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FGB3056-F085

Onsemi

FGB3056-F085 by Onsemi

FGB3056-F085 by Onsemi is an N-CHANNEL IGBT with a max VCEsat of 1.55V and a max IC of 29A, suitable for AUTOMOTIVE IGNITION applications. It has a package style of SMALL OUTLINE, can operate b/w -40 to 175 °C, and features a built-in diode for efficient switching with rise time of 2400ns and fall time of 1800ns.

Median Price

$1.560

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 2,198 parts In-Stock

1+ parts

$1.095

100+ parts

$1.073

1k+ parts

$1.057

10k+ parts

-

2,198

$1.095

$1.073

$1.057

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Chip1Stop

Japan . 285 parts In-Stock

1+ parts

$1.560

100+ parts

-

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-

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285

$1.560

-

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Adafruit Industries

USA . 3,000 parts In-Stock

1+ parts

$1.724

100+ parts

$1.569

1k+ parts

$1.414

10k+ parts

-

3,000

$1.724

$1.569

$1.414

-

DigiKey

USA . 113 parts In-Stock

1+ parts

$3.670

100+ parts

$1.857

1k+ parts

-

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113

$3.670

$1.857

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Verical

USA . 2,198 parts In-Stock

1+ parts

-

100+ parts

$1.073

1k+ parts

$1.057

10k+ parts

-

2,198

-

$1.073

$1.057

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Farnell

UK . 800 parts In-Stock

1+ parts

-

100+ parts

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$1.500

10k+ parts

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800

-

-

$1.500

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Rochester

USA . 700 parts In-Stock

1+ parts

-

100+ parts

$1.610

1k+ parts

$1.440

10k+ parts

$1.350

700

-

$1.610

$1.440

$1.350

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 505 parts In-Stock

1+ parts

$1.482

100+ parts

-

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-

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505

$1.482

-

-

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Vyrian

USA . 2,130 parts In-Stock

1+ parts

$1.500

100+ parts

-

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2,130

$1.500

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Distributors (Availability)

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Corphita

USA . 2,118 parts In-Stock

1+ parts

$1.404

100+ parts

-

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2,118

$1.404

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-

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Corohmni

South Africa . 303 parts In-Stock

1+ parts

$1.500

100+ parts

-

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303

$1.500

-

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Component Stockers USA

USA . 1,203 parts In-Stock

1+ parts

$1.580

100+ parts

$1.360

1k+ parts

$1.550

10k+ parts

-

1,203

$1.580

$1.360

$1.550

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$1.724

100+ parts

$1.569

1k+ parts

$1.414

10k+ parts

-

3,000

$1.724

$1.569

$1.414

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Kulean Microsystems

USA . 8,016 parts In-Stock

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8,016

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Problanco Electronics

Mexico . 6,003 parts In-Stock

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6,003

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SupplyDigital Components

Austria . 4,839 parts In-Stock

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4,839

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TANS Electronics

Latvia . 2,935 parts In-Stock

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2,935

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Supply Digital

USA . 2,623 parts In-Stock

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2,623

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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UHIMA Technologies

Türkiye . 912 parts In-Stock

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912

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Continental Prestige Electronics

USA . 800 parts In-Stock

1+ parts

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$1.500

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800

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$1.500

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Northwest PG Solutions

USA . 596 parts In-Stock

1+ parts

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596

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Microchip USA

USA . 225 parts In-Stock

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225

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Native Components

USA . 37 parts In-Stock

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37

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Overview

Unleash the power of automotive ignition systems with the FGB3056-F085 Insulated Gate Bipolar Transistor by Onsemi. This N-Channel transistor with a built-in diode offers exceptional quality and reliability for high-performance applications. Whether you're looking to optimize your vehicle's ignition system or enhance its overall efficiency, this product delivers unmatched value and benefits. Trust in Onsemi's expertise and innovation to take your automotive projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a good balance of durability and cost-effectiveness, making the product suitable for a wide range of applications.

Polarity or Channel Type: N-CHANNEL

N-Channel IGBTs generally have lower on-state voltage drop and faster switching speeds compared to P-Channel types, making them more efficient for many applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for simpler circuit design and protection against reverse current flow, enhancing the overall reliability of the product.

Transistor Application: AUTOMOTIVE IGNITION

Designed specifically for automotive ignition systems, this IGBT ensures reliable performance and high efficiency in this critical application.

Maximum Rise Time (tr): 2400 ns

The fast rise time helps to minimize switching losses and improve overall efficiency in high-frequency applications.

Maximum VCEsat: 1.55 V

The low collector-emitter saturation voltage results in lower power dissipation and higher efficiency in the circuit.

Maximum Power Dissipation (Abs): 200 W

With a high maximum power dissipation, this IGBT can handle higher load currents and provide reliable operation under challenging conditions.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature ensures that the IGBT can withstand elevated temperatures in automotive environments without compromising performance.

Maximum Collector-Emitter Voltage: 560 V

The high maximum voltage rating makes this IGBT suitable for high voltage applications, providing robust protection against voltage spikes.

Maximum Collector Current (IC): 29 A

With a high collector current rating, this IGBT can handle high current loads and deliver reliable performance in automotive ignition systems.

Maximum Turn Off Time (toff): 10000 ns

The long turn-off time allows for controlled switching and reduced stress on the components, improving the overall reliability of the product.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FGB3056-F085 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

560 V

Maximum Fall Time (tf):

1800 ns

Maximum Gate-Emitter Threshold Voltage:

2.2 V

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Rise Time (tr):

2400 ns

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

AUTOMOTIVE IGNITION

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

10000 ns

Nominal Turn Off Time (toff):

6200 ns

Maximum Turn On Time (ton):

3700 ns

Nominal Turn On Time (ton):

1560 ns

Maximum VCEsat:

1.55 V

Trade Compliance

FGB3056-F085 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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