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FGB3440G2-F085

Onsemi

FGB3440G2-F085 by Onsemi

FGB3440G2-F085 by Onsemi is an N-CHANNEL IGBT with 26.9A IC, 390V VCE, and 166W power dissipation. Ideal for applications requiring high power handling and temperature resistance up to 175°C. Suitable for surface mount assembly with a rise time of 7000ns and fall time of 15000ns.

Median Price

$2.105

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 755 parts In-Stock

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-

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$1.530

1k+ parts

$1.370

10k+ parts

$1.290

755

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$1.530

$1.370

$1.290

DigiKey

USA . 695 parts In-Stock

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$2.680

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695

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$2.680

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Flip Electronics (Authorized)

USA . 695 parts In-Stock

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695

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Distributors (In-Stock)

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Digiode

USA . 1,932 parts In-Stock

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$1.624

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$1.624

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Nova Conductors

Japan . 310 parts In-Stock

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$1.730

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$1.730

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Vyrian

USA . 7,480 parts In-Stock

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7,480

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Flip Electronics

USA . 986 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 696 parts In-Stock

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Bristol Electronics

USA . 696 parts In-Stock

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Dan-Mar Components

USA . 696 parts In-Stock

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696

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Distributors (Availability)

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Advanced Electronics

New Zealand . 600 parts In-Stock

1+ parts

$0.714

100+ parts

$0.650

1k+ parts

$0.585

10k+ parts

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600

$0.714

$0.650

$0.585

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Corohmni

South Africa . 206 parts In-Stock

1+ parts

$0.714

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206

$0.714

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Aztec Data Supply Inc.

USA . 1,000 parts In-Stock

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$1.071

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$1.071

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Ampacity Inc.

Singapore . 927 parts In-Stock

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$1.450

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$1.450

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Corphita

USA . 1,835 parts In-Stock

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$1.539

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$1.539

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Bastille Electronics

Australia . 10 parts In-Stock

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$1.730

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$1.644

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$1.561

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$1.540

10

$1.730

$1.644

$1.561

$1.540

Argo Parts USA

USA . 8,551 parts In-Stock

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$1.730

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$1.730

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Continental Prestige Electronics

USA . 3,203 parts In-Stock

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$1.730

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$1.695

3,203

$1.730

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$1.695

Netroflash

USA . 1,000 parts In-Stock

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$1.730

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$1.695

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$1.730

$1.695

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Component Stockers USA

USA . 301 parts In-Stock

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$99.990

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Kulean Microsystems

USA . 6,524 parts In-Stock

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Problanco Electronics

Mexico . 5,481 parts In-Stock

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SupplyDigital Components

Austria . 4,805 parts In-Stock

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Authorized Procurement Solutions

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Supply Digital

USA . 2,682 parts In-Stock

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TANS Electronics

Latvia . 2,568 parts In-Stock

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Perfect Parts

USA . 896 parts In-Stock

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UHIMA Technologies

Türkiye . 686 parts In-Stock

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Microchip USA

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Overview

Discover the power and reliability of the FGB3440G2-F085 by Onsemi, a top-of-the-line Insulated Gate Bipolar Transistor (IGBT) that offers exceptional performance in a compact package. Manufactured by Onsemi, a trusted name in the industry, this N-CHANNEL IGBT is designed to deliver superior power dissipation and precise control for a wide range of applications. Whether you're looking to optimize energy efficiency or enhance motor control systems, this IGBT is the ideal solution. With a maximum collector-emitter voltage of 390V and a maximum gate-emitter voltage of 12V, this high-quality component ensures reliable operation even under demanding conditions. Trust Onsemi's expertise and invest in the FGB3440G2-F085 for unparalleled value and performance.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL IGBTs typically have lower on-state voltage drop and higher switching speeds, making them suitable for high power applications.

Surface Mount: YES

Surface mount IGBTs are more compact and easier to mount on PCBs, making them suitable for space-constrained applications.

Maximum Rise Time (tr): 7000 ns

Faster rise time allows for quicker switching speed and helps in reducing switching losses in high frequency applications.

Maximum Fall Time (tf): 15000 ns

Longer fall time ensures smooth turn off of the transistor to avoid any voltage spikes or ringing, improving overall reliability.

Maximum Power Dissipation (Abs): 166 W

Higher power dissipation rating means the IGBT can handle greater power levels without overheating, making it suitable for high power applications.

Maximum Operating Temperature: 175 °C

Higher operating temperature range allows the IGBT to function in harsh environmental conditions without performance degradation.

Maximum Collector-Emitter Voltage: 390 V

Higher collector-emitter voltage rating provides greater safety margin and allows the IGBT to be used in high voltage circuits.

Maximum Gate-Emitter Voltage: 12 V

Lower gate-emitter voltage helps in reducing gate drive power and allows for efficient switching operations.

Maximum Collector Current (IC): 26.9 A

Higher collector current rating enables the IGBT to handle larger current loads, making it suitable for high power applications.

Maximum Gate-Emitter Threshold Voltage: 2.2 V

Lower gate-emitter threshold voltage makes the IGBT easier to drive and enhances its switching performance.

Terminal Finish: Matte Tin (Sn) - annealed

Matte tin finish provides good solderability and ensures reliable electrical connections.

Maximum Time At Peak Reflow Temperature (s): 30

Longer time at peak reflow temperature allows for proper soldering and enhances the durability of the connection.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures proper solder melting and solidification, resulting in robust solder joints.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FGB3440G2-F085 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

390 V

Maximum Fall Time (tf):

15000 ns

Maximum Gate-Emitter Threshold Voltage:

2.2 V

Maximum Gate-Emitter Voltage:

12 V

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

Maximum Operating Temperature:

175 Cel

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Rise Time (tr):

7000 ns

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

FGB3440G2-F085 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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