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FGB3040CS

Onsemi

FGB3040CS by Onsemi

FGB3040CS by Onsemi is an N-CHANNEL IGBT with 430V max collector-emitter voltage, 21A max collector current, and 150W max power dissipation. Ideal for applications requiring high-power switching in a compact SMALL OUTLINE package.

Median Price

$1.970

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 52,569 parts In-Stock

1+ parts

-

100+ parts

$1.700

1k+ parts

$1.520

10k+ parts

$1.430

52,569

-

$1.700

$1.520

$1.430

DigiKey

USA . 50,986 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.240

10k+ parts

-

50,986

-

-

$2.240

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 798 parts In-Stock

1+ parts

$1.796

100+ parts

-

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798

$1.796

-

-

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Vyrian

USA . 1,145 parts In-Stock

1+ parts

$1.890

100+ parts

-

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1,145

$1.890

-

-

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ComSIT Distribution GmbH

Germany . 680 parts In-Stock

1+ parts

-

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680

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ACDS - Activité Composants Distribution Service

France . 340 parts In-Stock

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-

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340

-

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-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,813 parts In-Stock

1+ parts

$1.701

100+ parts

-

1k+ parts

-

10k+ parts

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1,813

$1.701

-

-

-

Corohmni

South Africa . 365 parts In-Stock

1+ parts

$1.890

100+ parts

-

1k+ parts

-

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365

$1.890

-

-

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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56,986

-

-

-

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RC Electronics

USA . 48,095 parts In-Stock

1+ parts

-

100+ parts

$2.010

1k+ parts

$1.830

10k+ parts

$1.780

48,095

-

$2.010

$1.830

$1.780

Microchip USA

USA . 8,763 parts In-Stock

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-

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8,763

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A-Z Elektronik GmbH

Germany . 7,122 parts In-Stock

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7,122

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Kulean Microsystems

USA . 6,546 parts In-Stock

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6,546

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Alle Elektronik GmbH

Germany . 4,748 parts In-Stock

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4,748

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Glotronic Ltd.

UK . 3,900 parts In-Stock

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3,900

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SupplyDigital Components

Austria . 2,862 parts In-Stock

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2,862

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Supply Digital

USA . 2,525 parts In-Stock

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2,525

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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Northwest PG Solutions

USA . 1,451 parts In-Stock

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1,451

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Problanco Electronics

Mexico . 1,235 parts In-Stock

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1,235

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TANS Electronics

Latvia . 905 parts In-Stock

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905

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UHIMA Technologies

Türkiye . 873 parts In-Stock

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873

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Perfect Parts

USA . 474 parts In-Stock

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474

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Cyclops Electronics Ltd (Excess)

UK . 340 parts In-Stock

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340

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Native Components

USA . 214 parts In-Stock

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214

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Overview

Unlock the power of innovation with the FGB3040CS by Onsemi. As a leading manufacturer in the industry, Onsemi's Insulated Gate Bipolar Transistors (IGBT) are known for their high quality and reliability. This N-CHANNEL transistor offers a range of applications, from industrial to automotive, delivering superior performance and efficiency. With its compact design and advanced technology, the FGB3040CS provides customers with unmatched value, benefits, and advantages. Experience seamless operation and maximum productivity with this top-of-the-line product from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation properties and durability, making the IGBT suitable for a variety of applications.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs typically have lower on-state voltage drop and faster switching speed compared to P-channel, making them ideal for high power applications.

Configuration: SINGLE

Simplified design and ease of use in circuit applications.

Surface Mount: YES

Allows for easy integration onto circuit boards, saving space and facilitating automated assembly processes.

Maximum Rise Time (tr): 7000 ns

Fast rise time enables quick response in switching applications.

Package Shape: RECTANGULAR

Efficient use of space and easy mounting onto circuit boards.

Terminal Form: GULL WING

Provides strong mechanical support and ease of soldering during assembly.

Maximum Fall Time (tf): 15000 ns

Fast fall time allows for rapid turn-off in switching applications.

Nominal Turn Off Time (toff): 7300 ns

Quick turn-off time enhances efficiency and performance in circuit operations.

No. of Terminals: 6

Sufficient number of terminals for connecting to external circuitry.

Maximum Power Dissipation (Abs): 150 W

High power dissipation capability allows for handling of large currents and voltages.

Package Style (Meter): SMALL OUTLINE

Compact design for space-saving and efficient circuit board layout.

Maximum Operating Temperature: 175 °C

Wide operating temperature range makes the IGBT suitable for various environmental conditions.

Maximum Collector-Emitter Voltage: 430 V

High maximum voltage rating offers protection against voltage spikes and transients.

Transistor Element Material: SILICON

Silicon-based material provides good performance and reliability in electronic applications.

Maximum Gate-Emitter Voltage: 12 V

Safe operating voltage for gate control signals.

Maximum Collector Current (IC): 21 A

High collector current rating allows for handling of large current loads.

Maximum Gate-Emitter Threshold Voltage: 2.2 V

Low threshold voltage ensures efficient and reliable gate control.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and corrosion resistance.

Terminal Position: SINGLE

Simplifies connection to external circuitry and reduces complexity in assembly.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for safe and reliable reflow soldering during assembly processes.

Peak Reflow Temperature °C: 260

High reflow temperature tolerance for robust soldering processes.

Nominal Turn On Time (ton): 2100 ns

Fast turn-on time ensures quick response and efficient switching in circuit applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FGB3040CS attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

430 V

Configuration:

Maximum Fall Time (tf):

15000 ns

Maximum Gate-Emitter Threshold Voltage:

2.2 V

Maximum Gate-Emitter Voltage:

12 V

JESD-30 Code:

R-PSSO-G6

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

6

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Maximum Rise Time (tr):

7000 ns

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

7300 ns

Nominal Turn On Time (ton):

2100 ns

Trade Compliance

FGB3040CS Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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