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ECH8601R

Onsemi

ECH8601R by Onsemi

ECH8601R by Onsemi is an N-CHANNEL Power FET with 6.5A max drain current and 1.5W power dissipation. Ideal for applications requiring high efficiency in a compact design, such as power management systems or motor control circuits.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 1,089 parts In-Stock

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Vyrian

USA . 324 parts In-Stock

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Native Components

USA . 331 parts In-Stock

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$0.243

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$0.233

331

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Northwest PG Solutions

USA . 1,400 parts In-Stock

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$0.267

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$0.235

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Problanco Electronics

Mexico . 6,867 parts In-Stock

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SupplyDigital Components

Austria . 6,075 parts In-Stock

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Glotronic Ltd.

UK . 3,790 parts In-Stock

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TANS Electronics

Latvia . 1,248 parts In-Stock

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Kulean Microsystems

USA . 797 parts In-Stock

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Corphita

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Kepictronics

USA . 500 parts In-Stock

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Corohmni

South Africa . 448 parts In-Stock

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UHIMA Technologies

Türkiye . 369 parts In-Stock

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Overview

Unleash the power of innovation with the ECH8601R by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Power Field Effect Transistors that are designed to exceed expectations. This N-CHANNEL FET provides reliable performance and efficiency, making it ideal for a wide range of applications. Experience the value and benefits of this Enhancement Mode transistor, offering maximum drain current of 6.5 A and maximum power dissipation of 1.5 W. Trust Onsemi to provide cutting-edge technology that empowers your projects to reach new heights of success.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-Channel FETs typically have lower conduction losses than P-Channel FETs, making them more efficient in many applications.

Surface Mount: YES

Surface mount technology allows for compact and space-saving designs, making it ideal for applications where space is limited.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs can be easily controlled and are commonly used in switching applications.

Maximum Drain Current (Abs) (ID): 6.5 A

With a high maximum drain current, this FET can handle higher power requirements in your circuit.

Maximum Power Dissipation (Abs): 1.5 W

The low power dissipation allows for better efficiency and reliability in operation.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-Oxide Semiconductor technology offers good performance and reliability in a variety of applications.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this FET can withstand harsh environmental conditions.

Maximum Drain Current (ID): 6.5 A

The high maximum drain current rating ensures that the FET can handle demanding loads without overheating.

Technical Specifications

Power Field Effect Transistors (FET) ECH8601R attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Maximum Drain Current (Abs) (ID):

6.5 A

Maximum Drain Current (ID):

6.5 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Trade Compliance

ECH8601R Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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