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ECH8601M-TL-H

Onsemi

ECH8601M-TL-H by Onsemi

ECH8601M-TL-H by Onsemi is an N-CHANNEL FET with 2 elements, diode, and resistor. It has a max pulsed drain current of 60A and min DS breakdown voltage of 24V. Ideal for switching applications due to its common drain configuration and small outline package style.

Median Price

$0.311

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 704 parts In-Stock

1+ parts

-

100+ parts

$0.311

1k+ parts

$0.258

10k+ parts

$0.230

704

-

$0.311

$0.258

$0.230

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,093 parts In-Stock

1+ parts

$0.242

100+ parts

-

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-

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2,093

$0.242

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Chip Stock

USA . 44,000 parts In-Stock

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44,000

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Vyrian

USA . 7,368 parts In-Stock

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7,368

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Distributors (Availability)

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Corphita

USA . 2,292 parts In-Stock

1+ parts

$0.230

100+ parts

-

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2,292

$0.230

-

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Corohmni

South Africa . 56 parts In-Stock

1+ parts

$0.255

100+ parts

-

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56

$0.255

-

-

-

Native Components

USA . 331 parts In-Stock

1+ parts

$240.800

100+ parts

$235.984

1k+ parts

$233.576

10k+ parts

$231.168

331

$240.800

$235.984

$233.576

$231.168

Northwest PG Solutions

USA . 86 parts In-Stock

1+ parts

$264.880

100+ parts

-

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86

$264.880

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Metaverse IC Inc.

Canada . 30,000 parts In-Stock

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30,000

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QUARKTWIN TECHNOLOGY LTD

USA . 7,329 parts In-Stock

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7,329

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Problanco Electronics

Mexico . 7,050 parts In-Stock

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7,050

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Kepictronics

USA . 6,947 parts In-Stock

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6,947

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TANS Electronics

Latvia . 5,814 parts In-Stock

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5,814

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SupplyDigital Components

Austria . 4,877 parts In-Stock

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4,877

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Kulean Microsystems

USA . 2,536 parts In-Stock

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2,536

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UHIMA Technologies

Türkiye . 905 parts In-Stock

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905

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Overview

Experience the power of quality with the ECH8601M-TL-H by Onsemi. As a leading manufacturer in the industry, Onsemi is known for delivering top-notch Power Field Effect Transistors (FET) like this one. Ideal for switching applications, this N-CHANNEL transistor offers common drain configuration with built-in diode and resistor, ensuring efficient performance. With a maximum pulsed drain current of 60 A and a minimum DS breakdown voltage of 24 V, this transistor provides reliable functionality in various electronic devices. Trust Onsemi to deliver innovative solutions that meet your needs and exceed your expectations. Elevate your projects with the ECH8601M-TL-H today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Polarity or Channel Type: N-CHANNEL

Allows for efficient operation and high performance in switching applications.

Configuration: COMMON DRAIN, 2 ELEMENTS WITH BUILT-IN DIODE AND RESISTOR

Enables easy integration into circuits and saves space by combining multiple elements in one package.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring optimal performance and reliability in such use cases.

Surface Mount: YES

Facilitates easy and efficient mounting on circuit boards, saving time and effort during assembly.

Minimum DS Breakdown Voltage: 24 V

Provides a high breakdown voltage, making the product suitable for a wide range of voltage applications.

Package Shape: RECTANGULAR

Allows for efficient use of space on circuit boards, enabling compact and streamlined designs.

Terminal Form: FLAT

Ensures a secure connection and easy soldering during installation, reducing the risk of loose connections.

Operating Mode: ENHANCEMENT MODE

Enhances control and efficiency during operation, leading to better overall performance of the product.

No. of Elements: 2

Provides dual functionality in a single package, offering versatility in circuit design and configuration.

Maximum Pulsed Drain Current (IDM): 60 A

Handles high currents with ease, making it suitable for applications that require a reliable power supply.

No. of Terminals: 8

Offers multiple connection points for easy integration into circuits and ensures a secure electrical connection.

Package Style (Meter): SMALL OUTLINE

Features a compact and lightweight design, ideal for space-constrained applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Utilizes a reliable and efficient technology for power management, ensuring consistent performance over time.

Transistor Element Material: SILICON

Uses high-quality silicon material for the transistor element, guaranteeing long-term reliability and stability.

Terminal Finish: TIN BISMUTH

Provides a durable and corrosion-resistant finish on the terminals, ensuring long-lasting performance and connectivity.

Maximum Drain Current (ID): 8 A

Capable of handling high drain currents, making it suitable for demanding power applications.

Maximum Drain-Source On Resistance: 0.03 ohm

Features low on-resistance for efficient power management and minimal heat dissipation, enhancing overall performance.

Terminal Position: DUAL

Allows for versatile mounting options and flexible circuit configurations, accommodating various design requirements.

Technical Specifications

Power Field Effect Transistors (FET) ECH8601M-TL-H attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

24 V

Maximum Drain Current (ID):

8 A

Maximum Drain-Source On Resistance:

.03 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-F8

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

1

No. of Elements:

2

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

60 A

Surface Mount:

YES

Terminal Finish:

TIN BISMUTH

Terminal Form:

FLAT

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

ECH8601M-TL-H Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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