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CS4172N16

Onsemi

CS4172N16 by Onsemi

CS4172N16 by Onsemi is a BICMOS peripheral driver with 16 terminals. It operates in industrial temperature range (-40 to 105 °C) and supports power supplies of 5,8/13V. The package style is in-line rectangular made of plastic/epoxy, suitable for various applications requiring precise terminal positioning.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

Distributors (In-Stock)

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Digiode

USA . 335 parts In-Stock

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Vyrian

USA . 216 parts In-Stock

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216

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Distributors (Availability)

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Native Components

USA . 639 parts In-Stock

1+ parts

$0.507

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639

$0.507

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Northwest PG Solutions

USA . 43 parts In-Stock

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$0.558

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$0.492

43

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$0.492

Problanco Electronics

Mexico . 5,969 parts In-Stock

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5,969

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TANS Electronics

Latvia . 3,916 parts In-Stock

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Kulean Microsystems

USA . 3,741 parts In-Stock

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SupplyDigital Components

Austria . 1,436 parts In-Stock

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1,436

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Corphita

USA . 856 parts In-Stock

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UHIMA Technologies

Türkiye . 416 parts In-Stock

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Corohmni

South Africa . 155 parts In-Stock

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Overview

Discover the power and reliability of the CS4172N16 by Onsemi, a high-quality peripheral driver designed to enhance your electronic projects. Manufactured by Onsemi, a trusted industry leader, this product offers unmatched performance and durability. Perfect for a wide range of applications, this versatile device provides superior control and efficiency. Experience the value and benefits that the CS4172N16 brings to your projects, with its advanced technology and innovative design. Elevate your creations with Onsemi's exceptional product today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and protection for the internal components of the peripheral driver, making it suitable for long-term use.

Package Shape: RECTANGULAR

The rectangular shape of the package provides versatility in mounting options and allows for easy integration into various systems or setups.

Power Supplies (V): 5,8/13

With multiple power supply options of 5V, 8V, and 13V, this peripheral driver can be used in a wide range of applications with different voltage requirements.

No. of Terminals: 16

Having 16 terminals provides ample connectivity options for external devices or components, allowing for a broader range of functionalities.

Package Style (Meter): IN-LINE

The in-line package style makes it easy to connect the peripheral driver in a linear configuration, optimizing space efficiency and organization in the setup.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature of 105 °C ensures reliability and stability even under challenging environmental conditions or extended usage.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C allows the peripheral driver to function effectively in cold environments without any performance issues.

Terminal Finish: Tin/Lead (Sn/Pb)

The tin/lead terminal finish provides good conductivity and corrosion resistance, ensuring reliable connections and long-lasting performance.

Terminal Position: DUAL

The dual terminal position allows for flexible installation and connection options, accommodating different wiring configurations and setup requirements.

Temperature Grade: INDUSTRIAL

The industrial temperature grade certifies the peripheral driver for use in harsh industrial environments, where temperature fluctuations and rugged conditions are common.

Technology: BICMOS

The BICMOS technology combines the advantages of bipolar and CMOS technologies, offering high-speed performance and low power consumption for efficient operation.

Terminal Form: THROUGH-HOLE

The through-hole terminal form provides secure and stable connections, making it easier to solder or mount the peripheral driver onto a circuit board for reliable operation.

Terminal Pitch: 2.54 mm

The 2.54mm terminal pitch allows for compatibility with standard connectors and sockets, making it convenient to integrate the peripheral driver into existing systems or prototypes.

Technical Specifications

Peripheral Drivers CS4172N16 attributes and parameters. Explore more Peripheral Drivers devices from Onsemi

Specs

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e0

No. of Terminals:

16

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5,8/13

Qualification:

Not Qualified

Sub-Category:

Peripheral Drivers

Surface Mount:

NO

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

CS4172N16 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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