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CS4172DWR16

Onsemi

CS4172DWR16 by Onsemi

CS4172DWR16 by Onsemi is a BICMOS peripheral driver with 16 terminals. It operates in industrial temperature range (-40 to 105 °C) and supports power supplies of 5,8/13V. This rectangular package is surface mountable and ideal for various applications requiring small outline drivers.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,067 parts In-Stock

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2,067

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Vyrian

USA . 1,098 parts In-Stock

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1,098

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Distributors (Availability)

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Native Components

USA . 486 parts In-Stock

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$13.030

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486

$13.030

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Northwest PG Solutions

USA . 1,809 parts In-Stock

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$14.333

100+ parts

$12.900

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1,809

$14.333

$12.900

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SupplyDigital Components

Austria . 5,830 parts In-Stock

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5,830

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Problanco Electronics

Mexico . 5,365 parts In-Stock

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5,365

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TANS Electronics

Latvia . 2,007 parts In-Stock

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2,007

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Kulean Microsystems

USA . 1,973 parts In-Stock

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1,973

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Corphita

USA . 1,445 parts In-Stock

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Corohmni

South Africa . 313 parts In-Stock

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UHIMA Technologies

Türkiye . 170 parts In-Stock

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Overview

Elevate your projects with the CS4172DWR16 by Onsemi - the ultimate choice for high-quality peripheral drivers. Designed with precision and reliability in mind, Onsemi delivers top-notch products that exceed industry standards. From industrial automation to automotive applications, this versatile driver offers unparalleled performance and efficiency. Say goodbye to compromises - invest in a product that guarantees exceptional value, benefits, and advantages for all your engineering needs. Choose Onsemi and experience innovation like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the peripheral driver lightweight and durable, making it suitable for various applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient integration into printed circuit boards, saving space and simplifying the assembly process.

Power Supplies (V): 5,8/13

The peripheral driver supports multiple power supply voltages (5V, 8V, and 13V), offering flexibility in power requirements for different applications.

No. of Terminals: 16

With 16 terminals, the peripheral driver can accommodate a wide range of input and output connections, enabling versatile functionality.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature of 105 °C allows the peripheral driver to withstand harsh environmental conditions, ensuring reliable performance in various applications.

Technology: BICMOS

Utilizing BiCMOS technology combines the benefits of both bipolar and CMOS technologies, offering high-speed operation, low power consumption, and improved noise immunity.

Technical Specifications

Peripheral Drivers CS4172DWR16 attributes and parameters. Explore more Peripheral Drivers devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e0

No. of Terminals:

16

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5,8/13

Qualification:

Not Qualified

Sub-Category:

Peripheral Drivers

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

CS4172DWR16 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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