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CS4122XDWFR24G

Onsemi

CS4122XDWFR24G by Onsemi

CS4122XDWFR24G by Onsemi is a 24-terminal peripheral driver with max supply voltage of 5.5V, suitable for industrial applications. It offers built-in protections against over current and thermal issues, with a package style of small outline for compact designs. The device operates in temperatures ranging from -40 to 105 °C, making it ideal for various electronic systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,908 parts In-Stock

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Digiode

USA . 140 parts In-Stock

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140

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Native Components

USA . 803 parts In-Stock

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$12.638

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803

$12.638

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Northwest PG Solutions

USA . 1,561 parts In-Stock

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$13.902

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$12.512

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1,561

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SupplyDigital Components

Austria . 4,945 parts In-Stock

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TANS Electronics

Latvia . 4,215 parts In-Stock

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Glotronic Ltd.

UK . 3,700 parts In-Stock

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3,700

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Problanco Electronics

Mexico . 801 parts In-Stock

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UHIMA Technologies

Türkiye . 576 parts In-Stock

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Kulean Microsystems

USA . 328 parts In-Stock

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Corphita

USA . 295 parts In-Stock

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Microchip USA

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Corohmni

South Africa . 69 parts In-Stock

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Overview

Experience the unparalleled quality and reliability of the CS4122XDWFR24G by Onsemi, a leading manufacturer in the industry. This versatile peripheral driver offers built-in protections against over current and thermal issues, ensuring peace of mind for your applications. With its wide range of supply voltages and industrial-grade temperature grade, this product provides exceptional value and benefits to customers looking for a dependable solution. Trust Onsemi to deliver top-notch performance and efficiency in every use case.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body provides durability and protection, making this peripheral driver suitable for various environments and conditions.

Built-in Protections: OVER CURRENT; THERMAL

The built-in protections against over current and thermal issues ensure the safety and reliability of the connected peripherals, preventing damage and downtime.

Maximum Supply Voltage: 5.5 V

The maximum supply voltage of 5.5V allows for compatibility with a wide range of devices without risk of overloading, making it versatile in application.

Surface Mount: YES

The surface mount feature allows for easy and convenient installation on circuit boards, saving space and simplifying the overall design of the system.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature of 105 °C, this peripheral driver can withstand and perform reliably in demanding industrial environments.

Technical Specifications

Peripheral Drivers CS4122XDWFR24G attributes and parameters. Explore more Peripheral Drivers devices from Onsemi

Specs

Built-in Protections:

OVER CURRENT; THERMAL

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e3

Length:

15.395 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Output Current Flow Direction:

SOURCE AND SINK

Nominal Output Peak Current Limit:

.07 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP24,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5,12

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Maximum Supply Voltage-1:

14 V

Minimum Supply Voltage-1:

7.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

CS4122XDWFR24G Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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