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CS4192XDWF16

Onsemi

CS4192XDWF16 by Onsemi

CS4192XDWF16 by Onsemi is a peripheral driver with max supply voltage of 5.5V, built-in protections for over current and thermal issues. It operates in industrial temperature range and is ideal for applications requiring half bridge based peripheral drivers with source and sink output current flow direction.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,218 parts In-Stock

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Digiode

USA . 580 parts In-Stock

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580

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Distributors (Availability)

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Native Components

USA . 153 parts In-Stock

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$1.391

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153

$1.391

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Northwest PG Solutions

USA . 2,305 parts In-Stock

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$1.530

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$1.530

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AZTECH Wire

Italy . 721 parts In-Stock

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$16.370

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721

$16.370

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QUARKTWIN TECHNOLOGY LTD

USA . 28,151 parts In-Stock

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SupplyDigital Components

Austria . 7,525 parts In-Stock

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Kulean Microsystems

USA . 6,729 parts In-Stock

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6,729

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A-Z Elektronik GmbH

Germany . 6,603 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,402 parts In-Stock

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Metaverse IC Inc.

Canada . 3,916 parts In-Stock

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Microchip USA

USA . 3,044 parts In-Stock

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Corphita

USA . 2,211 parts In-Stock

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TANS Electronics

Latvia . 1,776 parts In-Stock

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Problanco Electronics

Mexico . 1,585 parts In-Stock

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UHIMA Technologies

Türkiye . 796 parts In-Stock

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Corohmni

South Africa . 424 parts In-Stock

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Overview

Unlock a new level of performance with the CS4192XDWF16 by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality peripheral drivers that provide reliability and efficiency. Ideal for a wide range of applications, this product offers built-in protections against over current and thermal issues, ensuring peace of mind for customers. With its compact design and advanced technology, the CS4192XDWF16 is the perfect solution for your electronic projects. Upgrade your systems today and experience the benefits of superior performance and innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ensuring it can withstand everyday wear and tear in various environments.

Built-in Protections: OVER CURRENT; THERMAL

The over current and thermal protections ensure the safety and longevity of the product by preventing damage from power surges and overheating, making it a reliable choice for continuous use.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature of 105 °C allows the product to function effectively in a wide range of temperature environments, making it suitable for industrial applications.

Interface IC Type: HALF BRIDGE BASED PERIPHERAL DRIVER

The half-bridge based design of the peripheral driver ensures efficient power management and control, making it a versatile option for driving various peripheral devices in electronics projects.

Technical Specifications

Peripheral Drivers CS4192XDWF16 attributes and parameters. Explore more Peripheral Drivers devices from Onsemi

Specs

Built-in Protections:

OVER CURRENT; THERMAL

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e0

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Output Current Flow Direction:

SOURCE AND SINK

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Power Supplies (V):

5,7.5/14

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Maximum Supply Voltage-1:

14 V

Minimum Supply Voltage-1:

7.5 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

CS4192XDWF16 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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