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CS4172XDWF16

Onsemi

CS4172XDWF16 by Onsemi

CS4172XDWF16 by Onsemi is a Peripheral Driver with 16 terminals, operating at -40 to 105 °C. It features built-in protections for over current and thermal issues, with a max supply voltage of 14 V. Ideal for industrial applications requiring buffer or inverter based peripheral drivers.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,235 parts In-Stock

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Vyrian

USA . 1,181 parts In-Stock

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1,181

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Distributors (Availability)

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Native Components

USA . 977 parts In-Stock

1+ parts

$2.105

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977

$2.105

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Northwest PG Solutions

USA . 162 parts In-Stock

1+ parts

$2.316

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162

$2.316

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Problanco Electronics

Mexico . 5,430 parts In-Stock

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TANS Electronics

Latvia . 4,223 parts In-Stock

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4,223

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SupplyDigital Components

Austria . 1,602 parts In-Stock

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Corphita

USA . 1,336 parts In-Stock

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UHIMA Technologies

Türkiye . 649 parts In-Stock

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649

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Kulean Microsystems

USA . 519 parts In-Stock

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519

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Corohmni

South Africa . 173 parts In-Stock

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Overview

Enhance your electronic devices with the reliable and efficient CS4172XDWF16 peripheral driver by Onsemi. Crafted with precision and quality, this product offers versatile applications in various industries. With built-in protections against overcurrent and thermal issues, customers can trust in the durability and longevity of their systems. Experience the value and benefits of this small outline package, from its wide temperature range to its source and sink output current flow direction. Elevate your projects with the innovative technology of Onsemi's CS4172XDWF16.

Feature Benefit Bullets

Package Body Material

PLASTIC/EPOXY material provides durability and heat resistance, making the product reliable for long-term use.

Surface Mount

Surface mount capability allows for easy and efficient PCB assembly.

Maximum Supply Voltage

With a maximum supply voltage of 5.5 V, this product is suitable for a wide range of applications.

Built-in Protections

Over current and thermal protections ensure the safety and longevity of connected devices and the peripheral driver itself.

Package Style

The small outline package style saves space on the PCB and is ideal for compact designs.

Maximum Operating Temperature

With a maximum operating temperature of 105 °C, this peripheral driver can withstand high temperature environments.

Minimum Operating Temperature

The product can operate in extreme low temperatures down to -40 °C.

Nominal Output Peak Current Limit

The nominal output peak current limit of 0.1 A ensures safe operation and protects connected devices from excessive current flow.

Output Current Flow Direction

Source and sink current flow direction capability allows the peripheral driver to drive various types of loads efficiently.

Technical Specifications

Peripheral Drivers CS4172XDWF16 attributes and parameters. Explore more Peripheral Drivers devices from Onsemi

Specs

Built-in Protections:

OVER CURRENT; THERMAL

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e0

Length:

10.3 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Output Current Flow Direction:

SOURCE AND SINK

Nominal Output Peak Current Limit:

.1 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5,8/13

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Maximum Supply Voltage-1:

14 V

Minimum Supply Voltage-1:

7.5 V

Nominal Supply Voltage-1:

13.5 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

CS4172XDWF16 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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