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CS4172DW16

Onsemi

CS4172DW16 by Onsemi

CS4172DW16 by Onsemi is a BICMOS peripheral driver with 16 terminals. It operates in industrial temperature range (-40 to 105 °C) and supports power supplies of 5,8/13V. This rectangular package is surface mountable and ideal for various applications requiring small outline drivers.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 1,956 parts In-Stock

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Vyrian

USA . 968 parts In-Stock

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968

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Northwest PG Solutions

USA . 1,522 parts In-Stock

1+ parts

$3.416

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1,522

$3.416

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TANS Electronics

Latvia . 7,582 parts In-Stock

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SupplyDigital Components

Austria . 4,260 parts In-Stock

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4,260

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Kulean Microsystems

USA . 2,081 parts In-Stock

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2,081

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Corphita

USA . 1,292 parts In-Stock

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Native Components

USA . 497 parts In-Stock

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$3.012

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497

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$3.012

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Problanco Electronics

Mexico . 389 parts In-Stock

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389

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Corohmni

South Africa . 68 parts In-Stock

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UHIMA Technologies

Türkiye . 18 parts In-Stock

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Overview

Unlock the potential of your electronic designs with the CS4172DW16 by Onsemi. As a leading manufacturer in the industry, Onsemi guarantees top-notch quality and reliability in their products. The CS4172DW16 falls under the Peripheral Drivers category, offering versatile applications for various electronic devices. With power supplies ranging from 5 to 13 volts and a wide operating temperature range, this product is perfect for industrial-grade projects. Experience seamless integration with its surface mount package style and dual terminal position. Trust in the value and benefits that the CS4172DW16 brings to your designs, ensuring optimal performance and efficiency every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material ensures durability and reliability for long-term use.

Surface Mount: YES

Surface mount design allows for easy installation on printed circuit boards, saving space and increasing efficiency.

Power Supplies (V): 5,8/13

Multiple power supply options provide flexibility in voltage requirements for different applications.

No. of Terminals: 16

Having 16 terminals allows for a wide range of connectivity options and compatibility with various systems.

Maximum Operating Temperature: 105 °C

High maximum operating temperature ensures stable performance in demanding industrial environments.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature enables this product to function effectively in extreme cold conditions.

Technology: BICMOS

BICMOS technology combines the benefits of both bipolar and CMOS technologies, providing high performance and low power consumption.

Technical Specifications

Peripheral Drivers CS4172DW16 attributes and parameters. Explore more Peripheral Drivers devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e0

No. of Terminals:

16

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5,8/13

Qualification:

Not Qualified

Sub-Category:

Peripheral Drivers

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

CS4172DW16 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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