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CS4192XDWFR16

Onsemi

CS4192XDWFR16 by Onsemi

CS4192XDWFR16 by Onsemi is a half bridge peripheral driver with 16 terminals. It operates b/w -40 to 105 °C, with a supply voltage range of 4.5-14 V. Suitable for industrial applications, it offers built-in protections against over current and thermal issues.

Median Price

$11.842

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Freelance Electronics

USA . 828 parts In-Stock

1+ parts

$11.842

100+ parts

$12.434

1k+ parts

$11.724

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828

$11.842

$12.434

$11.724

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Vyrian

USA . 5,328 parts In-Stock

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Digiode

USA . 1,430 parts In-Stock

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1,430

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 110 parts In-Stock

1+ parts

$11.842

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110

$11.842

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AZTECH Wire

Italy . 993 parts In-Stock

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$15.720

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993

$15.720

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Component Stockers USA

USA . 423 parts In-Stock

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$99.990

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423

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QUARKTWIN TECHNOLOGY LTD

USA . 14,108 parts In-Stock

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Microchip USA

USA . 5,790 parts In-Stock

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5,790

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SupplyDigital Components

Austria . 5,677 parts In-Stock

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Problanco Electronics

Mexico . 5,034 parts In-Stock

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5,034

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Metaverse IC Inc.

Canada . 3,916 parts In-Stock

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TANS Electronics

Latvia . 2,429 parts In-Stock

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Northwest PG Solutions

USA . 1,561 parts In-Stock

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Native Components

USA . 695 parts In-Stock

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695

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UHIMA Technologies

Türkiye . 284 parts In-Stock

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Kulean Microsystems

USA . 200 parts In-Stock

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Corphita

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129

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Overview

Discover the cutting-edge CS4192XDWFR16 by Onsemi, a top-of-the-line peripheral driver that offers unmatched quality and reliability. Manufactured by Onsemi, a trusted name in the industry, this product is designed to deliver superior performance and efficiency. Ideal for a wide range of applications, this device is perfect for those looking for a high-quality solution that provides excellent value. Experience the benefits of the CS4192XDWFR16 and elevate your projects to new heights with ease.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, making the product long-lasting and reliable.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 5.5 V

Suitable for low voltage applications, ensuring compatibility with a wide range of devices.

Built-in Protections: OVER CURRENT; THERMAL

Enhances safety and reliability by preventing damage from over current and excessive heat.

Nominal Supply Voltage: 5 V

Standard voltage level that is commonly used in many electronic systems, making this product versatile and widely compatible.

Technology: BICMOS

Utilizes BiCMOS technology, combining the benefits of both bipolar and CMOS technologies for improved performance and efficiency.

Output Current Flow Direction: SOURCE AND SINK

Allows bidirectional current flow, offering flexibility and versatility in controlling peripheral devices.

Technical Specifications

Peripheral Drivers CS4192XDWFR16 attributes and parameters. Explore more Peripheral Drivers devices from Onsemi

Specs

Built-in Protections:

OVER CURRENT; THERMAL

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e0

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Output Current Flow Direction:

SOURCE AND SINK

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Power Supplies (V):

5,7.5/14

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Maximum Supply Voltage-1:

14 V

Minimum Supply Voltage-1:

7.5 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

CS4192XDWFR16 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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