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CAX809JTBI-T3

Onsemi

CAX809JTBI-T3 by Onsemi

CAX809JTBI-T3 by Onsemi is a Power Management IC with 5V Nominal Voltage, -40 to 85 °C Operating Temperature Range, and Tin Terminal Finish. It is used in industrial applications for power supply support circuits due to its small outline package style and dual terminal position.

Median Price

$0.227

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

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Arrow

USA . 299 parts In-Stock

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$0.227

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Digiode

USA . 920 parts In-Stock

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$0.216

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J2 Sourcing AB

Sweden . 36,000 parts In-Stock

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Vyrian

USA . 6,530 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 2,759 parts In-Stock

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Bristol Electronics

USA . 2,759 parts In-Stock

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$0.263

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$0.105

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Dan-Mar Components

USA . 2,759 parts In-Stock

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Distributors (Availability)

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Native Components

USA . 213 parts In-Stock

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$0.150

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$0.144

213

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$0.144

Northwest PG Solutions

USA . 2,248 parts In-Stock

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$0.165

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$0.145

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$0.145

Ampacity Inc.

Singapore . 261 parts In-Stock

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$0.193

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Corphita

USA . 1,569 parts In-Stock

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$0.204

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Corohmni

South Africa . 359 parts In-Stock

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Metaverse IC Inc.

Canada . 60,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 17,008 parts In-Stock

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Kulean Microsystems

USA . 7,236 parts In-Stock

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SupplyDigital Components

Austria . 6,226 parts In-Stock

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TANS Electronics

Latvia . 2,998 parts In-Stock

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UHIMA Technologies

Türkiye . 627 parts In-Stock

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Microchip USA

USA . 344 parts In-Stock

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Problanco Electronics

Mexico . 65 parts In-Stock

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Overview

Experience superior power management with the CAX809JTBI-T3 by Onsemi. Known for their high-quality products, Onsemi delivers reliable solutions for various applications in the Power Management ICs category. This compact and versatile IC offers customers unmatched value and benefits, ensuring optimal performance and efficiency. Say goodbye to power supply issues with the CAX809JTBI-T3, designed to meet your industrial needs with ease.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable material that can withstand various environmental conditions.

Surface Mount: YES

Easy to install and saves space on the PCB.

Nominal Supply Voltage (Vsup): 5 V

Compatible with standard voltage requirements.

No. of Terminals: 3

Simplifies the connection process.

Minimum Operating Temperature: -40 °C

Can operate in extreme cold conditions.

Maximum Operating Temperature: 85 °C

Can operate in high temperature environments.

Width (mm): 1.3 mm

Compact size for efficient use of space.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Specifically designed to support power supply applications.

Technical Specifications

Power Management ICs CAX809JTBI-T3 attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Additional Features:

DETECTION THRESHOLD VOLTAGE IS 4V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Length:

2.92 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

3

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.22 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.2 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+4V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.3 mm

Trade Compliance

CAX809JTBI-T3 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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