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CAX810JTBI-T3

Onsemi

CAX810JTBI-T3 by Onsemi

CAX810JTBI-T3 by Onsemi is a Power Management IC with 3 terminals, operating at -40 to 85 °C. It has a supply voltage range of 1.2V to 5.5V and a threshold voltage of +4V, suitable for industrial applications requiring power supply support circuits in compact spaces. The package is small outline, low profile, with shrink pitch and gull wing terminals for surface mount assembly.

Median Price

$0.220

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 18,000 parts In-Stock

1+ parts

-

100+ parts

$0.238

1k+ parts

$0.197

10k+ parts

$0.176

18,000

-

$0.238

$0.197

$0.176

DigiKey

USA . 18,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.200

18,000

-

-

-

$0.200

Verical

USA . 18,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.220

18,000

-

-

-

$0.220

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,464 parts In-Stock

1+ parts

$0.158

100+ parts

-

1k+ parts

-

10k+ parts

-

2,464

$0.158

-

-

-

Digiode

USA . 694 parts In-Stock

1+ parts

$0.185

100+ parts

-

1k+ parts

-

10k+ parts

-

694

$0.185

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 213 parts In-Stock

1+ parts

$0.158

100+ parts

-

1k+ parts

-

10k+ parts

-

213

$0.158

-

-

-

Corphita

USA . 433 parts In-Stock

1+ parts

$0.176

100+ parts

-

1k+ parts

-

10k+ parts

-

433

$0.176

-

-

-

Component Stockers USA

USA . 16,943 parts In-Stock

1+ parts

$0.200

100+ parts

$0.190

1k+ parts

$0.170

10k+ parts

$0.170

16,943

$0.200

$0.190

$0.170

$0.170

Native Components

USA . 865 parts In-Stock

1+ parts

$0.904

100+ parts

-

1k+ parts

-

10k+ parts

-

865

$0.904

-

-

-

Northwest PG Solutions

USA . 2,149 parts In-Stock

1+ parts

$0.994

100+ parts

-

1k+ parts

-

10k+ parts

-

2,149

$0.994

-

-

-

Advanced Electronics

New Zealand . 5,000 parts In-Stock

1+ parts

$21.043

100+ parts

$19.149

1k+ parts

$17.255

10k+ parts

-

5,000

$21.043

$19.149

$17.255

-

Continental Prestige Electronics

USA . 18,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.177

10k+ parts

-

18,000

-

-

$0.177

-

Problanco Electronics

Mexico . 5,967 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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5,967

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-

-

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TANS Electronics

Latvia . 5,207 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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5,207

-

-

-

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Kulean Microsystems

USA . 4,849 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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4,849

-

-

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SupplyDigital Components

Austria . 2,165 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,165

-

-

-

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UHIMA Technologies

Türkiye . 504 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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504

-

-

-

-

Microchip USA

USA . 389 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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389

-

-

-

-

Overview

Discover the power of efficient and reliable power management with the CAX810JTBI-T3 by Onsemi. Crafted with precision and quality, this Power Management IC offers unparalleled performance and durability. Perfect for a wide range of applications, this product provides customers with seamless power supply support and optimal functionality. Experience the value and benefits that come with choosing Onsemi for your power management needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and reliability for the product's packaging.

Surface Mount: YES

Enables easy and efficient installation on a circuit board.

Nominal Supply Voltage (Vsup): 5 V

Suitable for a wide range of applications requiring a stable 5V power supply.

No. of Terminals: 3

Simplifies the connectivity and integration of the power management IC.

Maximum Operating Temperature: 85 °C

Ensures reliable performance even under high temperature conditions.

Minimum Operating Temperature: -40 °C

Allows the product to operate in low temperature environments as well.

Terminal Finish: Tin (Sn)

Provides a reliable electrical connection and corrosion resistance.

Width (mm): 1.3 mm

Compact size allows for space-efficient integration into electronic devices.

Minimum Supply Voltage (Vsup): 1.2 V

Supports low power applications with a minimum supply voltage of 1.2V.

Peak Reflow Temperature °C: 260

Can withstand high temperature reflow processes during manufacturing.

Temperature Grade: INDUSTRIAL

Suitable for industrial applications where temperature variations are common.

Terminal Form: GULL WING

Facilitates easy soldering and secure mechanical connection on the PCB.

Maximum Supply Voltage (Vsup): 5.5 V

Provides flexibility for applications requiring up to 5.5V supply voltage.

Technical Specifications

Power Management ICs CAX810JTBI-T3 attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Additional Features:

DETECTION THRESHOLD VOLTAGE IS 4V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Length:

2.92 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

3

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.22 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.2 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+4V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.3 mm

Trade Compliance

CAX810JTBI-T3 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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