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CAX809RTBI-T3

Onsemi

CAX809RTBI-T3 by Onsemi

CAX809RTBI-T3 by Onsemi is a Power Management IC with 3V Nominal Voltage, -40 to 85 °C Operating Temperature range, and 1.22mm Max Seated Height. Ideal for industrial applications requiring a compact SMALL OUTLINE package with GULL WING terminals for power supply support circuits.

Median Price

$0.229

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 42,000 parts In-Stock

1+ parts

-

100+ parts

$0.238

1k+ parts

$0.197

10k+ parts

$0.176

42,000

-

$0.238

$0.197

$0.176

Verical

USA . 42,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.220

42,000

-

-

-

$0.220

Distributors (In-Stock)

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Digiode

USA . 1,797 parts In-Stock

1+ parts

$0.185

100+ parts

-

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1,797

$0.185

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Vyrian

USA . 3,535 parts In-Stock

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3,535

-

-

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Distributors (Availability)

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Corohmni

South Africa . 230 parts In-Stock

1+ parts

$0.171

100+ parts

-

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230

$0.171

-

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Corphita

USA . 1,814 parts In-Stock

1+ parts

$0.176

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-

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1,814

$0.176

-

-

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AZTECH Wire

Italy . 400 parts In-Stock

1+ parts

$8.700

100+ parts

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400

$8.700

-

-

-

Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$21.026

100+ parts

$19.134

1k+ parts

$17.241

10k+ parts

-

1,000

$21.026

$19.134

$17.241

-

Continental Prestige Electronics

USA . 42,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.177

10k+ parts

-

42,000

-

-

$0.177

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TANS Electronics

Latvia . 5,799 parts In-Stock

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5,799

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Kulean Microsystems

USA . 3,502 parts In-Stock

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3,502

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Problanco Electronics

Mexico . 1,944 parts In-Stock

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Northwest PG Solutions

USA . 1,936 parts In-Stock

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1,936

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SupplyDigital Components

Austria . 1,905 parts In-Stock

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Microchip USA

USA . 373 parts In-Stock

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373

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UHIMA Technologies

Türkiye . 324 parts In-Stock

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324

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Native Components

USA . 125 parts In-Stock

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125

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Overview

Unlock the power of efficient power management with the CAX809RTBI-T3 by Onsemi. Designed with precision and reliability in mind, this Power Management IC offers unparalleled performance in a compact package. Ideal for a wide range of applications, this product ensures optimal energy utilization and seamless operation. Experience the superior quality and innovation that Onsemi is known for, and elevate your projects to new heights with the CAX809RTBI-T3.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material provides good thermal conductivity and electrical insulation, making it a reliable choice for power management ICs.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and reducing costs.

Nominal Supply Voltage (Vsup): 3 V

The 3V nominal supply voltage is suitable for various applications, providing a stable power source for the IC.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, this IC can withstand harsh environmental conditions without compromising performance.

Minimum Supply Voltage (Vsup): 1.2 V

The low minimum supply voltage of 1.2V allows for efficient power management and flexibility in different voltage requirements.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this IC meets the necessary standards for reliable operation in demanding environments.

Technical Specifications

Power Management ICs CAX809RTBI-T3 attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Additional Features:

DETECTION THRESHOLD VOLTAGE IS 2.63V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Length:

2.92 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

3

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.22 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.2 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+2.63V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.3 mm

Trade Compliance

CAX809RTBI-T3 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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