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CAX803MTBI-T3

Onsemi

CAX803MTBI-T3 by Onsemi

CAX803MTBI-T3 by Onsemi is a Power Management IC with 5V nominal voltage, -40 to 85 °C operating temperature range, and 1.2V min supply voltage. It is used in industrial applications for power supply support circuits due to its small outline package style and dual terminal position.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,385 parts In-Stock

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1,385

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Digiode

USA . 671 parts In-Stock

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671

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Native Components

USA . 139 parts In-Stock

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$57.310

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$55.018

139

$57.310

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$55.018

Northwest PG Solutions

USA . 920 parts In-Stock

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$63.041

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SupplyDigital Components

Austria . 6,398 parts In-Stock

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Problanco Electronics

Mexico . 6,212 parts In-Stock

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Kepictronics

USA . 4,534 parts In-Stock

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4,534

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TANS Electronics

Latvia . 3,598 parts In-Stock

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Corphita

USA . 1,031 parts In-Stock

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UHIMA Technologies

Türkiye . 828 parts In-Stock

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Kulean Microsystems

USA . 723 parts In-Stock

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Corohmni

South Africa . 229 parts In-Stock

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Overview

Experience the power of reliable and efficient power management with the CAX803MTBI-T3 by Onsemi. As a trusted manufacturer in the industry, Onsemi delivers top-quality Power Management ICs that are perfect for a wide range of applications. With a compact package style and a wide temperature range, this product ensures optimal performance in industrial settings. Say goodbye to power supply issues and hello to seamless operations with the CAX803MTBI-T3. Trust Onsemi to provide you with the best solutions for your power management needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the IC.

Surface Mount: YES

Enables easy and secure installation on a circuit board.

Nominal Supply Voltage (Vsup): 5 V

Works well with a standard 5V power supply, ensuring compatibility with common electronic devices.

No. of Terminals: 3

Simplifies the interface connections, making the IC easier to integrate into a circuit.

Maximum Operating Temperature: 85 °C

Ensures stable performance even in high-temperature environments.

Minimum Operating Temperature: -40 °C

Allows the IC to function reliably in cold conditions as well.

Terminal Finish: Tin (Sn)

Provides good conductivity and solderability for secure connections.

Width (mm): 1.3 mm

Compact size enables space-saving design in electronic devices.

Temperature Grade: INDUSTRIAL

Meets industrial standards for temperature range and performance.

Maximum Supply Voltage (Vsup): 5.5 V

Allows a margin above the nominal supply voltage for added safety and flexibility.

Technical Specifications

Power Management ICs CAX803MTBI-T3 attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Additional Features:

DETECTION THRESHOLD VOLTAGE IS 4.38V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Length:

2.92 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

3

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.22 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.2 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+4.38V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.3 mm

Trade Compliance

CAX803MTBI-T3 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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