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CAX809HTBI-T3

Onsemi

CAX809HTBI-T3 by Onsemi

CAX809HTBI-T3 by Onsemi is a Power Management IC with 3 terminals, operating b/w -40 to 85 °C. It has a nominal voltage of 5V and supports power supply circuits. The IC is in a small outline package suitable for industrial applications requiring low profile components.

Median Price

$0.263

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 5,920 parts In-Stock

1+ parts

-

100+ parts

$0.263

1k+ parts

$0.105

10k+ parts

$0.079

5,920

-

$0.263

$0.105

$0.079

Dan-Mar Components

USA . 5,920 parts In-Stock

1+ parts

-

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5,920

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ACDS - Activité Composants Distribution Service

France . 3,000 parts In-Stock

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3,000

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Digiode

USA . 161 parts In-Stock

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161

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Vyrian

USA . 93 parts In-Stock

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93

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 34 parts In-Stock

1+ parts

$8.870

100+ parts

-

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34

$8.870

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Northwest PG Solutions

USA . 1,147 parts In-Stock

1+ parts

$9.757

100+ parts

$8.781

1k+ parts

-

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1,147

$9.757

$8.781

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Kulean Microsystems

USA . 5,123 parts In-Stock

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5,123

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TANS Electronics

Latvia . 5,098 parts In-Stock

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5,098

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

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5,000

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Problanco Electronics

Mexico . 3,185 parts In-Stock

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3,185

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SupplyDigital Components

Austria . 2,077 parts In-Stock

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2,077

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Corphita

USA . 762 parts In-Stock

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762

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Microchip USA

USA . 463 parts In-Stock

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463

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Corohmni

South Africa . 351 parts In-Stock

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351

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UHIMA Technologies

Türkiye . 142 parts In-Stock

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142

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Overview

Discover the power of the CAX809HTBI-T3 by Onsemi, a top-of-the-line Power Management IC designed to elevate your applications to new heights. With a focus on quality and innovation, Onsemi delivers cutting-edge solutions that guarantee reliability and efficiency. Ideal for a wide range of industries, this product offers unmatched value and performance, ensuring seamless operation and optimal functionality. Trust Onsemi to provide you with the best-in-class products that exceed expectations and deliver lasting benefits for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability for long-term use.

Surface Mount: YES

Surface mount feature allows for easy and secure mounting on PCBs.

Nominal Supply Voltage (Vsup): 5 V

Ideal nominal supply voltage for compatibility with a wide range of applications.

No. of Terminals: 3

Optimal number of terminals for efficient power management connections.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance in various environments.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for use in extreme cold conditions.

Terminal Finish: Tin (Sn)

Tin terminal finish enhances solderability and conductivity.

Width (mm): 1.3 mm

Narrow width allows for space-saving installation in compact electronic devices.

Minimum Supply Voltage (Vsup): 1.2 V

Low minimum supply voltage enables operation in low power consumption applications.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures stability and performance in harsh industrial environments.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy and secure soldering during assembly.

Maximum Supply Voltage (Vsup): 5.5 V

Maximum supply voltage of 5.5 V provides a safe operating range for the power management IC.

Technical Specifications

Power Management ICs CAX809HTBI-T3 attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Additional Features:

DETECTION THRESHOLD VOLTAGE IS 4.55V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Length:

2.92 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

3

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.22 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.2 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+4.55V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.3 mm

Trade Compliance

CAX809HTBI-T3 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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