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CAX803STBI-T3

Onsemi

CAX803STBI-T3 by Onsemi

CAX803STBI-T3 by Onsemi is a Power Management IC with 3.3V nominal voltage, -40 to 85 °C operating temperature range, and 1.22mm seated height. It is ideal for industrial applications requiring power supply support circuits in a small outline package with dual terminals.

Median Price

$0.084

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 23,995 parts In-Stock

1+ parts

$0.107

100+ parts

-

1k+ parts

-

10k+ parts

$0.060

23,995

$0.107

-

-

$0.060

Verical

USA . 21,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.060

21,000

-

-

-

$0.060

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 195 parts In-Stock

1+ parts

$0.060

100+ parts

-

1k+ parts

-

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-

195

$0.060

-

-

-

Digiode

USA . 2,142 parts In-Stock

1+ parts

$0.102

100+ parts

-

1k+ parts

-

10k+ parts

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2,142

$0.102

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 328 parts In-Stock

1+ parts

$0.060

100+ parts

-

1k+ parts

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10k+ parts

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328

$0.060

-

-

-

Corphita

USA . 1,611 parts In-Stock

1+ parts

$0.096

100+ parts

-

1k+ parts

-

10k+ parts

-

1,611

$0.096

-

-

-

Component Stockers USA

USA . 57,204 parts In-Stock

1+ parts

$0.110

100+ parts

$0.110

1k+ parts

$0.110

10k+ parts

$0.060

57,204

$0.110

$0.110

$0.110

$0.060

Andel Nordic

Denmark . 462 parts In-Stock

1+ parts

$7.145

100+ parts

-

1k+ parts

$6.859

10k+ parts

$6.859

462

$7.145

-

$6.859

$6.859

Native Components

USA . 332 parts In-Stock

1+ parts

$255.170

100+ parts

$250.067

1k+ parts

$247.515

10k+ parts

$244.963

332

$255.170

$250.067

$247.515

$244.963

Northwest PG Solutions

USA . 768 parts In-Stock

1+ parts

$280.687

100+ parts

-

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10k+ parts

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768

$280.687

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-

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SupplyDigital Components

Austria . 7,200 parts In-Stock

1+ parts

-

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7,200

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Perfect Parts

USA . 6,681 parts In-Stock

1+ parts

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6,681

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Kulean Microsystems

USA . 6,521 parts In-Stock

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6,521

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Problanco Electronics

Mexico . 5,510 parts In-Stock

1+ parts

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5,510

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-

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TANS Electronics

Latvia . 1,750 parts In-Stock

1+ parts

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1,750

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UHIMA Technologies

Türkiye . 942 parts In-Stock

1+ parts

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100+ parts

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942

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Overview

Experience the seamless power management capabilities of the CAX803STBI-T3 by Onsemi. As a leading manufacturer in the industry, Onsemi brings unparalleled quality and reliability to their Power Management ICs. This small outline, low profile package offers a wide range of industrial applications with its nominal supply voltage of 3.3V and maximum operating temperature of 85 °C. With a dual terminal position and gull wing terminal form, this product ensures ease of use and installation. Trust Onsemi to deliver top-notch performance and efficiency in all your power supply support circuits. Elevate your projects with the CAX803STBI-T3 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good insulation and durability for the package, ensuring reliability in various operating conditions.

Surface Mount: YES

Surface mount capability enables easy and efficient PCB assembly, saving time and cost during manufacturing.

Nominal Supply Voltage (Vsup): 3.3 V

Optimal nominal supply voltage for efficient power management and compatibility with various electronic devices.

Maximum Operating Temperature: 85 °C

High maximum operating temperature tolerance ensures reliable performance in demanding industrial environments.

Minimum Operating Temperature: -40 °C

Wide range of minimum operating temperature allows for operation in extreme cold conditions without affecting performance.

Terminal Finish: Tin (Sn)

Tin terminal finish provides good solderability and conductivity, ensuring secure connections for efficient power delivery.

Other IC Type: POWER SUPPLY SUPPORT CIRCUIT

Designed specifically for power management support, ensuring optimized power delivery and efficiency in electronic systems.

Minimum Supply Voltage (Vsup): 1.2 V

Low minimum supply voltage allows for operation in low-power applications while maintaining stable performance.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable operation in harsh industrial environments with varying temperature conditions.

Terminal Pitch: 0.95 mm

Close terminal pitch allows for compact design and space-saving on the PCB, ideal for applications with limited board space.

Technical Specifications

Power Management ICs CAX803STBI-T3 attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Additional Features:

DETECTION THRESHOLD VOLTAGE IS 2.93V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Length:

2.92 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

3

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.22 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.2 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+2.93V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.3 mm

Trade Compliance

CAX803STBI-T3 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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