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CAX803RTBI-T3

Onsemi

CAX803RTBI-T3 by Onsemi

CAX803RTBI-T3 by Onsemi is a Power Management IC with 3V nominal voltage, -40 to 85 °C operating temp, and 1.2-5.5 V supply range. Ideal for industrial applications requiring small outline, low profile package with gull wing terminals for power supply support circuits.

Median Price

$0.263

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

ACDS - Activité Composants Distribution Service

France . 2,780 parts In-Stock

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Bristol Electronics

USA . 2,780 parts In-Stock

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$0.263

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$0.105

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2,780

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$0.263

$0.105

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Dan-Mar Components

USA . 2,780 parts In-Stock

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2,780

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Vyrian

USA . 447 parts In-Stock

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447

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Digiode

USA . 116 parts In-Stock

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Distributors (Availability)

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Native Components

USA . 113 parts In-Stock

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$0.382

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$0.367

113

$0.382

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$0.367

Northwest PG Solutions

USA . 1,508 parts In-Stock

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$0.420

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$0.371

1,508

$0.420

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$0.371

Ampacity Inc.

Singapore . 1,259 parts In-Stock

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$0.500

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1,259

$0.500

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Authorized Procurement Solutions

USA . 17,000 parts In-Stock

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SupplyDigital Components

Austria . 6,869 parts In-Stock

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Kulean Microsystems

USA . 6,185 parts In-Stock

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TANS Electronics

Latvia . 2,794 parts In-Stock

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Problanco Electronics

Mexico . 2,451 parts In-Stock

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Corphita

USA . 1,509 parts In-Stock

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Corohmni

South Africa . 242 parts In-Stock

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UHIMA Technologies

Türkiye . 173 parts In-Stock

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Overview

Enhance your power management capabilities with the CAX803RTBI-T3 by Onsemi. As a trusted manufacturer in the industry, Onsemi delivers top-quality Power Management ICs that are essential for various applications. This small outline, low profile IC offers exceptional performance with a nominal supply voltage of 3V and a wide operating temperature range. With its reliable tin terminal finish and industrial-grade design, the CAX803RTBI-T3 ensures optimal power supply support circuit performance. Upgrade your systems today with this advanced solution that provides long-lasting value and efficiency for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the power management IC.

Surface Mount: YES

Ease of installation and space-saving design for efficient circuit board layout.

Nominal Supply Voltage (Vsup): 3 V

Suitable for a wide range of applications with a stable supply voltage.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, making it suitable for industrial environments.

Minimum Operating Temperature: -40 °C

Operates efficiently even in low-temperature conditions for versatile usage.

Technical Specifications

Power Management ICs CAX803RTBI-T3 attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Additional Features:

DETECTION THRESHOLD VOLTAGE IS 2.63V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Length:

2.92 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

3

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.22 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.2 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+2.63V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.3 mm

Trade Compliance

CAX803RTBI-T3 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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