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CAX809STBI-T3

Onsemi

CAX809STBI-T3 by Onsemi

CAX809STBI-T3 by Onsemi is a Power Management IC with 3.3V nominal voltage, -40 to 85 °C operating temperature range, and 1.22mm max seated height. It is used in industrial applications for power supply support circuits due to its small outline, low profile package style and dual terminal position.

Median Price

$0.229

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 42,000 parts In-Stock

1+ parts

-

100+ parts

$0.238

1k+ parts

$0.197

10k+ parts

$0.176

42,000

-

$0.238

$0.197

$0.176

Verical

USA . 42,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.220

42,000

-

-

-

$0.220

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,816 parts In-Stock

1+ parts

$0.185

100+ parts

-

1k+ parts

-

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-

1,816

$0.185

-

-

-

Vyrian

USA . 4,259 parts In-Stock

1+ parts

-

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-

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4,259

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 138 parts In-Stock

1+ parts

$0.171

100+ parts

-

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-

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-

138

$0.171

-

-

-

Corphita

USA . 295 parts In-Stock

1+ parts

$0.176

100+ parts

-

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-

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-

295

$0.176

-

-

-

Component Stockers USA

USA . 46,431 parts In-Stock

1+ parts

$0.200

100+ parts

$0.190

1k+ parts

$0.170

10k+ parts

$0.170

46,431

$0.200

$0.190

$0.170

$0.170

Native Components

USA . 917 parts In-Stock

1+ parts

$12.444

100+ parts

-

1k+ parts

-

10k+ parts

-

917

$12.444

-

-

-

AZTECH Wire

Italy . 1,120 parts In-Stock

1+ parts

$12.880

100+ parts

-

1k+ parts

-

10k+ parts

-

1,120

$12.880

-

-

-

Northwest PG Solutions

USA . 1,437 parts In-Stock

1+ parts

$13.689

100+ parts

$12.320

1k+ parts

-

10k+ parts

-

1,437

$13.689

$12.320

-

-

Continental Prestige Electronics

USA . 42,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.177

10k+ parts

-

42,000

-

-

$0.177

-

SupplyDigital Components

Austria . 7,430 parts In-Stock

1+ parts

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7,430

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Kulean Microsystems

USA . 6,171 parts In-Stock

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6,171

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Problanco Electronics

Mexico . 1,494 parts In-Stock

1+ parts

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1,494

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TANS Electronics

Latvia . 1,450 parts In-Stock

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1,450

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Kepictronics

USA . 1,000 parts In-Stock

1+ parts

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1,000

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Microchip USA

USA . 203 parts In-Stock

1+ parts

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203

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UHIMA Technologies

Türkiye . 55 parts In-Stock

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55

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Overview

Power up your devices with the CAX809STBI-T3 by Onsemi, a high-quality Power Management IC designed to provide efficient and reliable power supply support. Manufactured by Onsemi, known for their cutting-edge technology and innovation in the industry, this IC offers a compact design, wide temperature range, and easy surface mount installation. Whether you're working on consumer electronics, industrial equipment, or automotive applications, the CAX809STBI-T3 delivers exceptional performance and value, making it the perfect choice for all your power management needs. Trust Onsemi to power your next project with excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material makes the product reliable and easy to handle.

Nominal Supply Voltage (Vsup): 3.3 V

Optimal supply voltage for efficient power management.

No. of Terminals: 3

Simplified interface with fewer connections.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, suitable for industrial applications.

Terminal Finish: Tin (Sn)

Provides good conductivity and corrosion resistance.

Length: 2.92 mm

Compact size for space-constrained applications.

Nominal Threshold Voltage (V): +2.93V

Precise threshold voltage for accurate power management.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial environments.

Terminal Form: GULL WING

Facilitates easy soldering and mounting on PCBs.

Technical Specifications

Power Management ICs CAX809STBI-T3 attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Additional Features:

DETECTION THRESHOLD VOLTAGE IS 2.93V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Length:

2.92 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

3

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.22 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.2 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+2.93V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.3 mm

Trade Compliance

CAX809STBI-T3 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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