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CAX803ZTBI-T3

Onsemi

CAX803ZTBI-T3 by Onsemi

CAX803ZTBI-T3 by Onsemi is a Power Management IC with 2.5V nominal voltage, -40 to 85 °C operating temperature range, and 1.22mm max seated height. It is used in industrial applications for power supply support circuits due to its small outline, low profile package style, and dual terminal position.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

< 1k

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Digiode

USA . 676 parts In-Stock

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Vyrian

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Native Components

USA . 5 parts In-Stock

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$8.870

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$8.870

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Northwest PG Solutions

USA . 1,424 parts In-Stock

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$9.757

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$8.781

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Component Stockers USA

USA . 532 parts In-Stock

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$99.990

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TANS Electronics

Latvia . 1,778 parts In-Stock

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Kulean Microsystems

USA . 1,347 parts In-Stock

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Problanco Electronics

Mexico . 924 parts In-Stock

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Corphita

USA . 720 parts In-Stock

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SupplyDigital Components

Austria . 603 parts In-Stock

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UHIMA Technologies

Türkiye . 600 parts In-Stock

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Corohmni

South Africa . 467 parts In-Stock

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Microchip USA

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Overview

Upgrade your power management capabilities with the CAX803ZTBI-T3 by Onsemi. Designed with precision and reliability in mind, this Power Management IC offers advanced solutions for a wide range of applications. With a focus on quality and innovation, Onsemi delivers cutting-edge technology to help you optimize performance and efficiency. Experience seamless integration, superior functionality, and unmatched durability with the CAX803ZTBI-T3. Elevate your projects and unlock new possibilities with this top-of-the-line product from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the IC, ensuring a longer lifespan.

Surface Mount: YES

Surface mount capability offers easier and more efficient PCB assembly process.

Nominal Supply Voltage (Vsup): 2.5 V

Suitable nominal supply voltage for various applications requiring stable power management.

No. of Terminals: 3

Optimal number of terminals for basic power management functions.

Maximum Operating Temperature: 85 °C

High maximum operating temperature tolerance allows the IC to function reliably in various environmental conditions.

Terminal Finish: Tin (Sn)

Tin finish enhances solderability and ensures efficient electrical connections during assembly.

Minimum Supply Voltage (Vsup): 1.2 V

Low minimum supply voltage requirement enables compatibility with a wide range of power sources.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures stability and performance in harsh operating conditions.

Terminal Pitch: 0.95 mm

Compact terminal pitch allows for high-density PCB designs and space-saving solutions.

Technical Specifications

Power Management ICs CAX803ZTBI-T3 attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Additional Features:

DETECTION THRESHOLD VOLTAGE IS 2.32V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Length:

2.92 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

3

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.22 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.2 V

Nominal Supply Voltage (Vsup):

2.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+2.32V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.3 mm

Trade Compliance

CAX803ZTBI-T3 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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