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BU806BS

Onsemi

BU806BS by Onsemi

BU806BS by Onsemi is a NPN BJT with Darlington configuration, ideal for amplifier applications. It features a max collector-emitter voltage of 200V, max collector current of 8A, and min DC current gain of 100. The package style is flange mount with through-hole terminals.

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2

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1k+

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Vyrian

USA . 1,719 parts In-Stock

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Digiode

USA . 777 parts In-Stock

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TANS Electronics

Latvia . 7,353 parts In-Stock

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Problanco Electronics

Mexico . 5,955 parts In-Stock

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SupplyDigital Components

Austria . 4,214 parts In-Stock

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Kulean Microsystems

USA . 3,243 parts In-Stock

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Northwest PG Solutions

USA . 2,275 parts In-Stock

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Corphita

USA . 1,511 parts In-Stock

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Native Components

USA . 721 parts In-Stock

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Corohmni

South Africa . 204 parts In-Stock

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UHIMA Technologies

Türkiye . 154 parts In-Stock

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Overview

Elevate your amplifier projects with the BU806BS by Onsemi, a premium Power Bipolar Junction Transistor that delivers unmatched performance and reliability. Manufactured by Onsemi, a trusted name in the industry, this NPN transistor features a unique Darlington configuration with a built-in diode and resistor, making it ideal for a wide range of amplifier applications. With a minimum DC current gain of 100 and a maximum collector-emitter voltage of 200V, this transistor offers superior quality and efficiency. Upgrade your designs with the BU806BS and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the transistor, enhancing its durability and reliability.

Polarity or Channel Type: NPN

NPN transistors are commonly used in amplification circuits, making this product suitable for amplifier applications.

Configuration: DARLINGTON WITH BUILT-IN DIODE AND RESISTOR

The Darlington configuration offers high current gain and low saturation voltage, while the built-in diode and resistor add convenience and functionality.

Transistor Application: AMPLIFIER

Designed specifically for amplifier applications, ensuring optimal performance in such circuits.

Terminal Form: THROUGH-HOLE

Through-hole terminals make it easy to solder the transistor onto a circuit board, providing a reliable connection.

Maximum Operating Temperature: 150 °C

Can operate at high temperatures without any issues, suitable for demanding environments.

Maximum Collector-Emitter Voltage: 200 V

Can handle high voltage levels, providing flexibility in circuit design.

Maximum Collector Current (IC): 8 A

Capable of handling high currents, making it suitable for power applications.

Terminal Finish: TIN LEAD

Tin lead finish helps in soldering the transistor easily onto a circuit board.

Technical Specifications

Power Bipolar Junction Transistors (BJT) BU806BS attributes and parameters. Explore more Power Bipolar Junction Transistors (BJT) devices from Onsemi

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

8 A

Maximum Collector-Emitter Voltage:

200 V

Minimum DC Current Gain (hFE):

100

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

NPN

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

BU806BS Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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