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7WBD383CMX1TCG

Onsemi

7WBD383CMX1TCG by Onsemi

The Onsemi 7WBD383CMX1TCG is a Bus Driver & Transceiver with 2 bits, 0.25 ns propagation delay, and operating temperature range of -55 to 125 °C. It is used in military applications for its small outline package style and dual terminal position, suitable for surface mount assembly.

Median Price

$0.203

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

$0.211

1k+ parts

$0.175

10k+ parts

$0.156

6,000

-

$0.211

$0.175

$0.156

Verical

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.195

6,000

-

-

-

$0.195

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,026 parts In-Stock

1+ parts

$0.164

100+ parts

-

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-

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-

2,026

$0.164

-

-

-

Vyrian

USA . 2,440 parts In-Stock

1+ parts

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2,440

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 111 parts In-Stock

1+ parts

$0.146

100+ parts

-

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-

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111

$0.146

-

-

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Corphita

USA . 726 parts In-Stock

1+ parts

$0.156

100+ parts

-

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-

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726

$0.156

-

-

-

AZTECH Wire

Italy . 874 parts In-Stock

1+ parts

$15.520

100+ parts

-

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874

$15.520

-

-

-

Native Components

USA . 528 parts In-Stock

1+ parts

$38.551

100+ parts

-

1k+ parts

-

10k+ parts

$37.009

528

$38.551

-

-

$37.009

Northwest PG Solutions

USA . 2,330 parts In-Stock

1+ parts

$42.406

100+ parts

-

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-

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2,330

$42.406

-

-

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TANS Electronics

Latvia . 6,233 parts In-Stock

1+ parts

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6,233

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SupplyDigital Components

Austria . 6,204 parts In-Stock

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6,204

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Continental Prestige Electronics

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.146

10k+ parts

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6,000

-

-

$0.146

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Problanco Electronics

Mexico . 5,323 parts In-Stock

1+ parts

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5,323

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Kulean Microsystems

USA . 5,291 parts In-Stock

1+ parts

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5,291

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UHIMA Technologies

Türkiye . 340 parts In-Stock

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340

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Microchip USA

USA . 307 parts In-Stock

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307

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Overview

Unlock the power of seamless communication with the 7WBD383CMX1TCG bus driver and transceiver by Onsemi. Crafted with precision and reliability, this product is designed to elevate your projects to new heights. Ideal for a multitude of applications, this small outline package offers unparalleled performance in a military-grade temperature range. Experience the ease of integration and unmatched quality that Onsemi is renowned for. Elevate your projects with the 7WBD383CMX1TCG today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material ensures durability and lightweight design, making it ideal for use in various applications.

Surface Mount: YES

Surface mount capability allows for easy installation and space-saving design.

Nominal Supply Voltage / Vsup (V): 4.5

Operating at a nominal supply voltage of 4.5V provides efficient power consumption and stable performance.

Propagation Delay (tpd): 0.25 ns

Low propagation delay of 0.25 ns ensures fast and accurate signal transmission.

Maximum Operating Temperature: 125 °C

High maximum operating temperature of 125 °C ensures reliable performance even in harsh environmental conditions.

Width: 1 mm

Compact width of 1 mm enables space-saving design for applications with limited space available.

Output Polarity: TRUE

True output polarity ensures accurate signal transmission without any distortion.

Minimum Supply Voltage (Vsup): 4 V

Minimum supply voltage of 4V ensures stable operation without compromising performance.

Technical Specifications

Bus Driver & Transceivers 7WBD383CMX1TCG attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Family:

CBT/FST/QS/5C/B

JESD-30 Code:

R-PDSO-N8

JESD-609 Code:

e4

Length:

1.45 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

2

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Propagation Delay (tpd):

.25 ns

Qualification:

Not Qualified

Maximum Seated Height:

.4 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.35 mm

Terminal Position:

DUAL

Width:

1 mm

Trade Compliance

7WBD383CMX1TCG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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