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7WBD3125BMX1TCG

Onsemi

7WBD3125BMX1TCG by Onsemi

7WBD3125BMX1TCG by Onsemi is a Bus Driver & Transceiver with 2 functions, 8 terminals, and 0.25 ns propagation delay. It operates in a temperature range of -55 to 125 °C and has a supply voltage of 4-5.5 V. Ideal for military applications requiring true output polarity and 3-state characteristics.

Median Price

$0.203

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 8,975 parts In-Stock

1+ parts

-

100+ parts

$0.211

1k+ parts

$0.175

10k+ parts

$0.156

8,975

-

$0.211

$0.175

$0.156

Verical

USA . 8,975 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

$0.195

8,975

-

-

-

$0.195

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 977 parts In-Stock

1+ parts

$0.146

100+ parts

-

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977

$0.146

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-

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Digiode

USA . 381 parts In-Stock

1+ parts

$0.164

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-

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381

$0.164

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 105 parts In-Stock

1+ parts

$0.146

100+ parts

-

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105

$0.146

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Corphita

USA . 1,788 parts In-Stock

1+ parts

$0.156

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-

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1,788

$0.156

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Continental Prestige Electronics

USA . 8,975 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$0.146

10k+ parts

-

8,975

-

-

$0.146

-

SupplyDigital Components

Austria . 7,979 parts In-Stock

1+ parts

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7,979

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TANS Electronics

Latvia . 7,862 parts In-Stock

1+ parts

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7,862

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Problanco Electronics

Mexico . 3,553 parts In-Stock

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3,553

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Northwest PG Solutions

USA . 714 parts In-Stock

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714

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Microchip USA

USA . 349 parts In-Stock

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349

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UHIMA Technologies

Türkiye . 288 parts In-Stock

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288

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Native Components

USA . 279 parts In-Stock

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279

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Kulean Microsystems

USA . 5 parts In-Stock

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5

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Overview

Enhance your electronic designs with the high-quality 7WBD3125BMX1TCG bus driver & transceiver by Onsemi. Designed with precision and reliability in mind, this product offers seamless signal transmission and efficient communication between devices. Ideal for a wide range of applications, this component guarantees optimal performance and long-lasting durability. Trust Onsemi's reputation for excellence and elevate your projects with the value and benefits that the 7WBD3125BMX1TCG provides.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and resistance to harsh environments, making the product suitable for long-term use in various conditions.

Surface Mount: YES

Being surface mountable makes installation easier and more efficient, saving time and effort during assembly.

Nominal Supply Voltage / Vsup (V): 4.5

The specified voltage ensures stable and reliable performance, preventing voltage fluctuations that could potentially damage the product.

Output Characteristics: 3-STATE

The 3-state output allows for more flexible control over the bus driver, enabling efficient data transmission and communication.

Maximum Seated Height: 0.4 mm

The low profile design saves space and allows for compact installations, especially in tight or limited spaces.

Temperature Grade: MILITARY

With military-grade temperature tolerance, this product can withstand extreme conditions without compromising performance or reliability.

Technical Specifications

Bus Driver & Transceivers 7WBD3125BMX1TCG attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Family:

CBT/FST/QS/5C/B

JESD-30 Code:

R-PBGA-B8

JESD-609 Code:

e4

Length:

1.6 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Propagation Delay (tpd):

.25 ns

Qualification:

Not Qualified

Maximum Seated Height:

.4 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Width:

1 mm

Trade Compliance

7WBD3125BMX1TCG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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