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7WBD3305CMX1TCG

Onsemi

7WBD3305CMX1TCG by Onsemi

The Onsemi 7WBD3305CMX1TCG is a Bus Driver & Transceiver with 2 functions, operating at -55 to 125 °C. It has a propagation delay of 0.25 ns and features TRUE output polarity. This component is ideal for military-grade applications requiring precise signal transmission in compact spaces.

Median Price

$0.203

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

$0.211

1k+ parts

$0.175

10k+ parts

$0.156

6,000

-

$0.211

$0.175

$0.156

Verical

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.195

6,000

-

-

-

$0.195

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,573 parts In-Stock

1+ parts

$0.146

100+ parts

-

1k+ parts

-

10k+ parts

-

1,573

$0.146

-

-

-

Digiode

USA . 1,240 parts In-Stock

1+ parts

$0.164

100+ parts

-

1k+ parts

-

10k+ parts

-

1,240

$0.164

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 148 parts In-Stock

1+ parts

$0.146

100+ parts

-

1k+ parts

-

10k+ parts

-

148

$0.146

-

-

-

Corphita

USA . 357 parts In-Stock

1+ parts

$0.156

100+ parts

-

1k+ parts

-

10k+ parts

-

357

$0.156

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 8,546 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,546

-

-

-

-

Continental Prestige Electronics

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.146

10k+ parts

-

6,000

-

-

$0.146

-

SupplyDigital Components

Austria . 5,556 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,556

-

-

-

-

Kulean Microsystems

USA . 3,373 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,373

-

-

-

-

Problanco Electronics

Mexico . 2,485 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,485

-

-

-

-

Northwest PG Solutions

USA . 1,023 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$4.498

10k+ parts

-

1,023

-

-

$4.498

-

TANS Electronics

Latvia . 899 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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899

-

-

-

-

UHIMA Technologies

Türkiye . 595 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

595

-

-

-

-

Native Components

USA . 568 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$4.452

10k+ parts

-

568

-

-

$4.452

-

Microchip USA

USA . 398 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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398

-

-

-

-

Overview

Unlock the power of seamless communication with Onsemi's 7WBD3305CMX1TCG Bus Driver & Transceivers. Manufactured with precision and expertise, this versatile device offers reliable performance in a variety of applications. From industrial automation to automotive electronics, this product delivers exceptional value and efficiency. Experience the advantage of quality engineering and unparalleled functionality with Onsemi's innovative technology. Join the future of connectivity with the 7WBD3305CMX1TCG.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials provide durability and reliability, making this product suitable for various operating conditions.

Surface Mount: YES

Surface-mount technology allows for efficient and compact installation on PCBs, saving space and reducing assembly time.

No. of Functions: 2

Having multiple functions in a single component helps in simplifying circuit design and reducing overall system complexity.

Package Shape: RECTANGULAR

Rectangular package shape is commonly used and easy to handle during assembly and installation.

Nominal Supply Voltage / Vsup (V): 4.5

Having a specific nominal supply voltage ensures stable and consistent performance within the recommended operating range.

No. of Terminals: 8

Having multiple terminals allows for versatile connectivity options and integration with other components in the system.

Package Style: GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The Grid Array style with a thin profile and fine pitch enables high-density mounting on PCBs, ideal for space-constrained applications.

Propagation Delay (tpd): 0.25 ns

Low propagation delay ensures fast signal transmission and response time, crucial for high-speed communication systems.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions and prolonged operation without performance degradation.

Output Characteristics: 3-STATE

3-state output allows for multiple logic levels, enhancing flexibility and compatibility with different signal processing requirements.

Minimum Operating Temperature: -55 °C

Wide operating temperature range ensures reliable operation in extreme cold conditions, making this product suitable for diverse applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Nickel/palladium/gold terminal finish provides excellent conductivity, corrosion resistance, and solderability, ensuring long-term reliability.

Terminal Position: BOTTOM

Bottom terminal position allows for easy and secure soldering to the PCB, enhancing mechanical strength and electrical connections.

No. of Ports: 2

Having multiple ports enables simultaneous communication with different devices or subsystems, expanding the versatility and connectivity of the product.

Maximum Seated Height: 0.4 mm

Low seated height helps in achieving a compact and slim profile, ideal for space-constrained designs and applications.

Width: 1 mm

Narrow width facilitates dense packing of components on the PCB, optimizing board space and enabling efficient layout designs.

Output Polarity: TRUE

True output polarity ensures correct signal representation and compatibility with standard logic levels, enhancing overall system performance.

Minimum Supply Voltage (Vsup): 4 V

Having a specific minimum supply voltage requirement ensures proper functionality and prevents issues related to voltage under-specification.

Length: 1.45 mm

Compact length offers flexibility in placement and positioning on the PCB, contributing to efficient board layout and design optimization.

Temperature Grade: MILITARY

Military-grade temperature specifications ensure reliability and performance in demanding environmental conditions, making this product suitable for rugged applications.

Terminal Form: BUTT

Butt terminal form provides a secure and stable connection, reducing the risk of signal loss or disconnection during operation.

Terminal Pitch: 0.35 mm

Fine terminal pitch allows for high-density mounting and precise alignment on the PCB, improving overall reliability and signal integrity.

Maximum Supply Voltage (Vsup): 5.5 V

Having a specific maximum supply voltage rating prevents overvoltage issues and ensures safe operation within the specified limits.

Technical Specifications

Bus Driver & Transceivers 7WBD3305CMX1TCG attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Family:

CBT/FST/QS/5C/B

JESD-30 Code:

R-PBGA-B8

JESD-609 Code:

e4

Length:

1.45 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Propagation Delay (tpd):

.25 ns

Qualification:

Not Qualified

Maximum Seated Height:

.4 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.35 mm

Terminal Position:

BOTTOM

Width:

1 mm

Trade Compliance

7WBD3305CMX1TCG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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