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7WBD3126AMX1TCG

Onsemi

7WBD3126AMX1TCG by Onsemi

The Onsemi 7WBD3126AMX1TCG is a Bus Driver & Transceiver with 2 functions, operating at a supply voltage range of 4-5.5V. Featuring a propagation delay of 0.25ns, it is suitable for military-grade applications requiring fast signal transmission in compact spaces. With a very thin profile and fine pitch package style, this device is ideal for high-density electronic systems where space optimization is crucial.

Median Price

$0.188

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 12,000 parts In-Stock

1+ parts

-

100+ parts

$0.211

1k+ parts

$0.175

10k+ parts

$0.156

12,000

-

$0.211

$0.175

$0.156

DigiKey

USA . 12,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.180

12,000

-

-

-

$0.180

Farnell

UK . 12,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.146

12,000

-

-

-

$0.146

Verical

USA . 12,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.195

12,000

-

-

-

$0.195

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,546 parts In-Stock

1+ parts

$0.146

100+ parts

-

1k+ parts

-

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1,546

$0.146

-

-

-

Digiode

USA . 2,480 parts In-Stock

1+ parts

$0.164

100+ parts

-

1k+ parts

-

10k+ parts

-

2,480

$0.164

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 427 parts In-Stock

1+ parts

$0.146

100+ parts

-

1k+ parts

-

10k+ parts

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427

$0.146

-

-

-

Corphita

USA . 294 parts In-Stock

1+ parts

$0.156

100+ parts

-

1k+ parts

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10k+ parts

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294

$0.156

-

-

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QUARKTWIN TECHNOLOGY LTD

USA . 24,753 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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24,753

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-

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Continental Prestige Electronics

USA . 12,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$0.146

10k+ parts

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12,000

-

-

$0.146

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Kulean Microsystems

USA . 7,516 parts In-Stock

1+ parts

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100+ parts

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7,516

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Microchip USA

USA . 5,496 parts In-Stock

1+ parts

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5,496

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SupplyDigital Components

Austria . 4,026 parts In-Stock

1+ parts

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4,026

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Problanco Electronics

Mexico . 3,442 parts In-Stock

1+ parts

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3,442

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TANS Electronics

Latvia . 3,188 parts In-Stock

1+ parts

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3,188

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Northwest PG Solutions

USA . 1,903 parts In-Stock

1+ parts

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1,903

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Native Components

USA . 698 parts In-Stock

1+ parts

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698

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UHIMA Technologies

Türkiye . 623 parts In-Stock

1+ parts

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100+ parts

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623

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Overview

Experience seamless and reliable data transmission with the 7WBD3126AMX1TCG by Onsemi. Crafted with precision and quality materials, this bus driver & transceiver ensures optimal performance in a wide range of applications. Whether you're in the military or industrial sector, this product offers enhanced functionality and efficiency. Trust Onsemi's reputation for excellence and elevate your systems with the cutting-edge technology of the 7WBD3126AMX1TCG.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material for long-lasting performance.

Surface Mount: YES

Easy to install and saves space on the circuit board.

No. of Functions: 2

Provides multiple functions in a single component, making it efficient.

Package Shape: RECTANGULAR

Standard shape for easy integration into circuit designs.

Nominal Supply Voltage / Vsup (V): 4.5

Operates at a commonly used voltage level for compatibility.

No. of Terminals: 8

Sufficient terminals for connectivity and functionality.

Propagation Delay (tpd): 0.25 ns

Fast signal propagation for quick response times.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures for reliable operation in various environments.

Output Characteristics: 3-STATE

Ability to be in one of three logic states for versatile output control.

Minimum Operating Temperature: -55 °C

Suitable for use in extreme cold conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Corrosion-resistant finish for long-term use.

Width: 1 mm

Compact size for space-saving installation.

Output Polarity: TRUE

Clear and reliable output polarity for accurate signal processing.

Maximum Time At Peak Reflow Temperature (s): 40

Can withstand peak reflow temperature for proper soldering.

Temperature Grade: MILITARY

Meets military standards for rugged and reliable performance.

Terminal Pitch: 0.5 mm

Fine pitch for precise connections and compact design.

Maximum Supply Voltage (Vsup): 5.5 V

Operates within a safe voltage range for stable performance.

Technical Specifications

Bus Driver & Transceivers 7WBD3126AMX1TCG attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Family:

CBT/FST/QS/5C/B

JESD-30 Code:

R-PBGA-B8

JESD-609 Code:

e4

Length:

1.95 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

2

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

.25 ns

Qualification:

Not Qualified

Maximum Seated Height:

.4 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

1 mm

Trade Compliance

7WBD3126AMX1TCG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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