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7WBD3125CMX1TCG

Onsemi

7WBD3125CMX1TCG by Onsemi

The Onsemi 7WBD3125CMX1TCG is a Bus Driver & Transceiver with 2 functions, operating at -55 to 125 °C. It has a propagation delay of 0.25 ns and supports a supply voltage range of 4-5.5 V. Ideal for military applications requiring fast signal transmission in compact spaces.

Median Price

$0.188

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 9,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.146

9,000

-

-

-

$0.146

Rochester

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

$0.211

1k+ parts

$0.175

10k+ parts

$0.156

6,000

-

$0.211

$0.175

$0.156

DigiKey

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.180

6,000

-

-

-

$0.180

Verical

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.195

6,000

-

-

-

$0.195

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,068 parts In-Stock

1+ parts

$0.146

100+ parts

-

1k+ parts

-

10k+ parts

-

1,068

$0.146

-

-

-

Digiode

USA . 724 parts In-Stock

1+ parts

$0.164

100+ parts

-

1k+ parts

-

10k+ parts

-

724

$0.164

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 485 parts In-Stock

1+ parts

$0.146

100+ parts

-

1k+ parts

-

10k+ parts

-

485

$0.146

-

-

-

Corphita

USA . 340 parts In-Stock

1+ parts

$0.156

100+ parts

-

1k+ parts

-

10k+ parts

-

340

$0.156

-

-

-

Native Components

USA . 814 parts In-Stock

1+ parts

$620.200

100+ parts

$607.796

1k+ parts

$601.594

10k+ parts

$595.392

814

$620.200

$607.796

$601.594

$595.392

Northwest PG Solutions

USA . 2,196 parts In-Stock

1+ parts

$682.220

100+ parts

-

1k+ parts

-

10k+ parts

-

2,196

$682.220

-

-

-

Kulean Microsystems

USA . 8,369 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,369

-

-

-

-

Continental Prestige Electronics

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.146

10k+ parts

-

6,000

-

-

$0.146

-

Problanco Electronics

Mexico . 4,907 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,907

-

-

-

-

TANS Electronics

Latvia . 4,536 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,536

-

-

-

-

SupplyDigital Components

Austria . 766 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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766

-

-

-

-

UHIMA Technologies

Türkiye . 667 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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667

-

-

-

-

Microchip USA

USA . 314 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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314

-

-

-

-

Overview

Looking for a reliable and efficient bus driver & transceiver? Look no further than the Onsemi 7WBD3125CMX1TCG. With a reputation for high-quality products, Onsemi delivers top-notch performance and durability. Ideal for a wide range of applications, this product offers customers unmatched value and benefits. Say goodbye to unreliable components and hello to seamless functionality with the Onsemi 7WBD3125CMX1TCG. Trust in Onsemi for all your bus driver & transceiver needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the product lightweight and durable, ideal for portable and rugged applications.

Surface Mount: YES

Surface mount feature allows for easy installation on circuit boards, saving space and reducing assembly time.

No. of Functions: 2

Having multiple functions in a single component simplifies circuit design and reduces the number of external components needed.

Package Shape: RECTANGULAR

Rectangular package shape enables efficient use of space on the circuit board, making it ideal for compact designs.

Nominal Supply Voltage / Vsup (V): 4.5

Operating at a low nominal supply voltage of 4.5V helps in reducing power consumption and heat generation.

No. of Terminals: 8

Having 8 terminals provides flexibility in connecting to other components and peripherals in the circuit.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Grid array and fine pitch design offer high connection density and reliability in signal transmission.

Propagation Delay (tpd): 0.25 ns

Ultra-low propagation delay of 0.25ns ensures fast signal processing and minimal latency in data transmission.

Maximum Operating Temperature: 125 °C

High maximum operating temperature of 125 °C allows the device to function reliably in harsh environmental conditions.

Output Characteristics: 3-STATE

3-state output allows for multiple signal states, providing versatility in controlling different components in the circuit.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature of -55 °C ensures the device can operate in extreme cold environments without performance degradation.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Nickel/Palladium/Gold terminal finish offers excellent conductivity and corrosion resistance, ensuring long-term reliability.

Terminal Position: BOTTOM

Bottom terminal position makes it easy to solder and mount the component onto the circuit board securely.

No. of Ports: 2

Having 2 ports allows for versatile connectivity options and enables the device to interface with multiple external devices.

Maximum Seated Height: 0.4 mm

Low maximum seated height of 0.4mm enables a compact overall design, saving space in electronic systems.

Width: 1 mm

Narrow width of 1mm facilitates tight PCB layout designs and efficient space utilization.

Output Polarity: TRUE

True output polarity ensures accurate signal representation and compatibility with other components in the circuit.

Minimum Supply Voltage (Vsup): 4 V

Operating at a minimum supply voltage of 4V ensures consistent performance even under low power conditions.

Length: 1.45 mm

Compact length of 1.45mm allows for a small footprint on the circuit board, especially in space-constrained applications.

Temperature Grade: MILITARY

Military-grade temperature tolerance ensures reliable operation in extreme temperature environments and mission-critical applications.

Terminal Form: BUTT

Butt terminal form provides a secure and reliable electrical connection, reducing the risk of signal loss or disconnection.

Terminal Pitch: 0.35 mm

Fine terminal pitch of 0.35mm allows for high-density mounting and interconnection with other components, optimizing PCB layout.

Maximum Supply Voltage (Vsup): 5.5 V

High maximum supply voltage of 5.5V offers flexibility in power input options and ensures compatibility with a wide range of systems.

Technical Specifications

Bus Driver & Transceivers 7WBD3125CMX1TCG attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Family:

CBT/FST/QS/5C/B

JESD-30 Code:

R-PBGA-B8

JESD-609 Code:

e4

Length:

1.45 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Propagation Delay (tpd):

.25 ns

Qualification:

Not Qualified

Maximum Seated Height:

.4 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.35 mm

Terminal Position:

BOTTOM

Width:

1 mm

Trade Compliance

7WBD3125CMX1TCG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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