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7WBD3126AMUTCG

Onsemi

7WBD3126AMUTCG by Onsemi

7WBD3126AMUTCG by Onsemi is a Bus Driver & Transceiver with 2 functions, 3-STATE output, and 0.25 ns propagation delay. Ideal for military applications, it operates b/w -55 to 125 °C with a supply voltage range of 4-5.5 V. Package style is CHIP CARRIER, VERY THIN PROFILE measuring 1.6mm x 1.6mm in size.

Median Price

$0.298

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

$0.293

1k+ parts

$0.243

10k+ parts

$0.217

3,000

-

$0.293

$0.243

$0.217

Verical

USA . 3,000 parts In-Stock

1+ parts

-

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-

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10k+ parts

$0.304

3,000

-

-

-

$0.304

Distributors (In-Stock)

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Vyrian

USA . 1,245 parts In-Stock

1+ parts

$0.209

100+ parts

-

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1,245

$0.209

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Digiode

USA . 921 parts In-Stock

1+ parts

$0.229

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921

$0.229

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 488 parts In-Stock

1+ parts

$0.209

100+ parts

-

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488

$0.209

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Corphita

USA . 767 parts In-Stock

1+ parts

$0.217

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-

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767

$0.217

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Kulean Microsystems

USA . 7,871 parts In-Stock

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7,871

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SupplyDigital Components

Austria . 6,865 parts In-Stock

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6,865

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Problanco Electronics

Mexico . 4,485 parts In-Stock

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4,485

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Kepictronics

USA . 3,500 parts In-Stock

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3,500

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Continental Prestige Electronics

USA . 3,000 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

$0.216

10k+ parts

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3,000

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$0.216

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

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100+ parts

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3,000

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Northwest PG Solutions

USA . 2,263 parts In-Stock

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2,263

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TANS Electronics

Latvia . 896 parts In-Stock

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896

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Microchip USA

USA . 292 parts In-Stock

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292

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Native Components

USA . 252 parts In-Stock

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252

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UHIMA Technologies

Türkiye . 12 parts In-Stock

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12

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Overview

Discover the 7WBD3126AMUTCG by Onsemi, a top-quality Bus Driver & Transceiver that offers unparalleled reliability and performance. Manufactured by Onsemi, a trusted industry leader, this product is perfect for a wide range of applications. With its advanced features and cutting-edge technology, this chip carrier boasts a very thin profile and a true output polarity, making it a must-have for any project. Experience the benefits of quick propagation delay, low power consumption, and military-grade temperature tolerance. Elevate your designs with the 7WBD3126AMUTCG from Onsemi today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, ideal for use in various industrial applications.

Surface Mount: YES

The surface mount feature allows for easy installation and replacement of the product on circuit boards, saving time and effort during manufacturing or maintenance.

No. of Functions: 2

With two functions in one component, this product offers increased functionality and versatility in applications, reducing the need for additional components and simplifying designs.

Nominal Supply Voltage / Vsup (V): 4.5

The nominal supply voltage of 4.5V ensures stable and reliable performance of the product within the specified operating range, providing consistent functionality in varied conditions.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125 °C ensures the product can withstand harsh environmental conditions and extended usage without compromising performance.

Output Characteristics: 3-STATE

The 3-STATE output characteristics allow the product to control the output effectively and flexibly, enabling efficient communication and signal processing in a circuit.

Temperature Grade: MILITARY

The military-grade temperature rating indicates that this product meets stringent quality and reliability standards, making it suitable for use in demanding military and aerospace applications.

Technical Specifications

Bus Driver & Transceivers 7WBD3126AMUTCG attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Family:

CBT/FST/QS/5C/B

JESD-30 Code:

S-PBCC-N8

Length:

1.6 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

2

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC8,.06SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay (tpd):

.25 ns

Qualification:

Not Qualified

Maximum Seated Height:

.6 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL GOLD PALLADIUM

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.6 mm

Trade Compliance

7WBD3126AMUTCG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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