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7WBD3126USG

Onsemi

7WBD3126USG by Onsemi

7WBD3126USG by Onsemi is a Bus Driver & Transceiver with 2 functions, 3-STATE output, and 0.25 ns propagation delay. Ideal for military applications due to its MIL temperature grade, small outline package style, and dual terminal position.

Median Price

$0.270

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 48,762 parts In-Stock

1+ parts

-

100+ parts

$0.292

1k+ parts

$0.242

10k+ parts

$0.216

48,762

-

$0.292

$0.242

$0.216

DigiKey

USA . 31,328 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.240

31,328

-

-

-

$0.240

Flip Electronics (Authorized)

USA . 31,328 parts In-Stock

1+ parts

-

100+ parts

-

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10k+ parts

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31,328

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-

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Verical

USA . 27,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.270

27,000

-

-

-

$0.270

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,211 parts In-Stock

1+ parts

$0.181

100+ parts

-

1k+ parts

-

10k+ parts

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1,211

$0.181

-

-

-

Digiode

USA . 1,390 parts In-Stock

1+ parts

$0.228

100+ parts

-

1k+ parts

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10k+ parts

-

1,390

$0.228

-

-

-

Flip Electronics

USA . 31,328 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

31,328

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 86 parts In-Stock

1+ parts

$0.181

100+ parts

-

1k+ parts

-

10k+ parts

-

86

$0.181

-

-

-

Corphita

USA . 729 parts In-Stock

1+ parts

$0.216

100+ parts

-

1k+ parts

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10k+ parts

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729

$0.216

-

-

-

Microchip USA

USA . 5,723 parts In-Stock

1+ parts

$1.723

100+ parts

-

1k+ parts

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10k+ parts

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5,723

$1.723

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Native Components

USA . 621 parts In-Stock

1+ parts

$29.170

100+ parts

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621

$29.170

-

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Northwest PG Solutions

USA . 1,869 parts In-Stock

1+ parts

$32.087

100+ parts

$28.878

1k+ parts

-

10k+ parts

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1,869

$32.087

$28.878

-

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Kepictronics

USA . 56,000 parts In-Stock

1+ parts

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56,000

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Continental Prestige Electronics

USA . 47,000 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

$0.290

10k+ parts

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47,000

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$0.290

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SupplyDigital Components

Austria . 7,371 parts In-Stock

1+ parts

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7,371

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Problanco Electronics

Mexico . 2,986 parts In-Stock

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2,986

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Kulean Microsystems

USA . 2,068 parts In-Stock

1+ parts

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2,068

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TANS Electronics

Latvia . 1,268 parts In-Stock

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1,268

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UHIMA Technologies

Türkiye . 659 parts In-Stock

1+ parts

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100+ parts

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659

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Overview

Discover the unmatched quality of the Onsemi 7WBD3126USG, a top-of-the-line Bus Driver & Transceiver that offers unparalleled performance and reliability. With Onsemi's reputation as a trusted manufacturer, this product is designed to meet the highest standards in the industry. Ideal for a wide range of applications, this device provides seamless communication between components, ensuring smooth operation and efficiency. Experience the value of superior technology with the 7WBD3126USG, delivering benefits that exceed expectations and driving success for customers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body ensures durability and reliability of the product in various operating conditions.

Surface Mount: YES

Being surface mountable makes the product easier to install and requires less space, ideal for compact designs.

No. of Functions: 2

Having 2 functions in a single device adds versatility and functionality, making it a cost-effective and efficient choice.

Nominal Supply Voltage / Vsup (V): 4.5

The nominal supply voltage of 4.5V offers compatibility with standard power supplies, ensuring easy integration into existing systems.

Propagation Delay (tpd): 0.25 ns

With a low propagation delay of 0.25 ns, the product provides high-speed performance and responsiveness in data transmission.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125 °C allows the product to function reliably even in harsh environments.

Output Characteristics: 3-STATE

The 3-state output characteristics offer flexibility in controlling the output signal, enabling efficient communication in a bus network.

Width: 2 mm

The compact width of 2 mm makes the product suitable for space-constrained applications, ensuring efficient use of available board space.

Temperature Grade: MILITARY

The military-grade temperature rating ensures the product's reliability and performance in extreme temperature conditions, making it suitable for rugged applications.

Technical Specifications

Bus Driver & Transceivers 7WBD3126USG attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Family:

CBT/FST/QS/5C/B

JESD-30 Code:

R-PDSO-G8

Length:

2.3 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

2

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.12,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay (tpd):

.25 ns

Qualification:

Not Qualified

Maximum Seated Height:

.9 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL GOLD PALLADIUM

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

2 mm

Trade Compliance

7WBD3126USG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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