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7WBD3126CMX1TCG

Onsemi

7WBD3126CMX1TCG by Onsemi

The Onsemi 7WBD3126CMX1TCG is a Bus Driver & Transceiver with 2 functions, operating at a supply voltage range of 4-5.5V. Featuring a propagation delay of 0.25ns, it is ideal for military-grade applications requiring fast signal transmission in compact spaces. With a very thin profile and fine pitch package style, this device offers high performance in harsh environments.

Median Price

$0.211

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

$0.211

1k+ parts

$0.175

10k+ parts

$0.156

6,000

-

$0.211

$0.175

$0.156

Farnell

UK . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.146

6,000

-

-

-

$0.146

Verical

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.219

6,000

-

-

-

$0.219

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,079 parts In-Stock

1+ parts

$0.146

100+ parts

-

1k+ parts

-

10k+ parts

-

2,079

$0.146

-

-

-

Digiode

USA . 395 parts In-Stock

1+ parts

$0.164

100+ parts

-

1k+ parts

-

10k+ parts

-

395

$0.164

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 218 parts In-Stock

1+ parts

$0.146

100+ parts

-

1k+ parts

-

10k+ parts

-

218

$0.146

-

-

-

Corphita

USA . 334 parts In-Stock

1+ parts

$0.156

100+ parts

-

1k+ parts

-

10k+ parts

-

334

$0.156

-

-

-

Native Components

USA . 152 parts In-Stock

1+ parts

$24.674

100+ parts

-

1k+ parts

-

10k+ parts

-

152

$24.674

-

-

-

Northwest PG Solutions

USA . 2,180 parts In-Stock

1+ parts

$27.142

100+ parts

$24.428

1k+ parts

-

10k+ parts

-

2,180

$27.142

$24.428

-

-

SupplyDigital Components

Austria . 8,120 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,120

-

-

-

-

Continental Prestige Electronics

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.146

10k+ parts

-

6,000

-

-

$0.146

-

Problanco Electronics

Mexico . 4,856 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,856

-

-

-

-

TANS Electronics

Latvia . 4,347 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,347

-

-

-

-

Kulean Microsystems

USA . 3,276 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,276

-

-

-

-

UHIMA Technologies

Türkiye . 807 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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807

-

-

-

-

Microchip USA

USA . 488 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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488

-

-

-

-

Overview

Unleash the power of reliable communication with the 7WBD3126CMX1TCG by Onsemi. As a leading manufacturer in the industry, Onsemi guarantees top-notch quality and performance in every product. This bus driver & transceiver offers seamless integration and efficient data transmission for a wide range of applications. With its advanced features and robust design, this product ensures unmatched reliability and durability. Elevate your projects with the 7WBD3126CMX1TCG and experience the ultimate value it brings to your systems.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for use in buses where weight and durability are important factors.

No. of Functions: 2

Having 2 functions in one device provides added functionality and versatility, making it a cost-effective and space-saving choice for bus driver & transceiver applications.

Propagation Delay (tpd): 0.25 ns

The low propagation delay ensures fast and efficient signal transmission, making it suitable for high-speed data transfer in bus communication systems.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature range ensures the device can withstand the heat generated inside buses, maintaining reliable performance even in harsh conditions.

Terminal Form: BUTT

The butt terminal form provides a secure and reliable connection, reducing the risk of signal loss or disconnection during operation, making it a reliable choice for bus communication systems.

Technical Specifications

Bus Driver & Transceivers 7WBD3126CMX1TCG attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Family:

CBT/FST/QS/5C/B

JESD-30 Code:

R-PBGA-B8

JESD-609 Code:

e4

Length:

1.45 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

2

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Propagation Delay (tpd):

.25 ns

Qualification:

Not Qualified

Maximum Seated Height:

.4 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.35 mm

Terminal Position:

BOTTOM

Width:

1 mm

Trade Compliance

7WBD3126CMX1TCG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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