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7WBD3126DMUTCG

Onsemi

7WBD3126DMUTCG by Onsemi

The Onsemi 7WBD3126DMUTCG is a Bus Driver & Transceiver with 2 functions, operating at a supply voltage range of 4-5.5V. Featuring a propagation delay of 0.25ns, it offers TRUE output polarity and operates in temperatures from -55 to 125 °C. Ideal for military-grade applications requiring fast signal transmission in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 2,164 parts In-Stock

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Vyrian

USA . 1,186 parts In-Stock

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SupplyDigital Components

Austria . 7,204 parts In-Stock

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Kulean Microsystems

USA . 6,593 parts In-Stock

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TANS Electronics

Latvia . 5,472 parts In-Stock

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Corphita

USA . 2,410 parts In-Stock

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Problanco Electronics

Mexico . 2,042 parts In-Stock

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UHIMA Technologies

Türkiye . 878 parts In-Stock

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878

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Northwest PG Solutions

USA . 354 parts In-Stock

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Native Components

USA . 252 parts In-Stock

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Corohmni

South Africa . 72 parts In-Stock

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Overview

Elevate your electronic designs with the 7WBD3126DMUTCG by Onsemi, a top-quality bus driver & transceiver that boasts superior performance and reliability. Manufactured by Onsemi, a trusted name in the industry, this product offers unmatched value and benefits to customers. Ideal for a wide range of applications, this compact device features a small outline and very thin profile, making it perfect for space-constrained projects. Whether you're working on military-grade equipment or consumer electronics, this versatile component delivers exceptional results. Trust Onsemi to provide cutting-edge technology that meets your needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body makes this product lightweight and durable, which is ideal for transportation applications.

Surface Mount: YES

Being surface mountable allows for easy and secure installation on circuit boards, saving space and improving overall reliability.

No. of Functions: 2

Having multiple functions integrated into one device reduces the need for additional components, simplifying design and increasing efficiency.

Nominal Supply Voltage / Vsup (V): 4.5

The nominal supply voltage of 4.5V ensures compatibility with a wide range of systems and power sources.

Propagation Delay (tpd): 0.25 ns

The low propagation delay of 0.25ns ensures fast and efficient data transmission, crucial for real-time communication in bus driver applications.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125 °C, this product can withstand harsh environmental conditions and high temperature operation.

Technology: CMOS

The CMOS technology used in this product provides low power consumption and high noise immunity, making it suitable for battery-operated devices and reliable communication.

Technical Specifications

Bus Driver & Transceivers 7WBD3126DMUTCG attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Family:

CBT/FST/QS/5C/B

JESD-30 Code:

R-PDSO-N8

Length:

1.95 mm

Logic IC Type:

No. of Bits:

1

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.04,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Power Supplies (V):

5

Propagation Delay (tpd):

.25 ns

Qualification:

Not Qualified

Maximum Seated Height:

.55 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

1 mm

Trade Compliance

7WBD3126DMUTCG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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