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74VHC157M

Onsemi

74VHC157M by Onsemi

MULTIPLEXER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR;

Median Price

$0.522

Lifecycle Status

Suppliers In-Stock

26

In-Stock Inventory

1k+

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Arrow

USA . 538 parts In-Stock

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$0.051

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DigiKey

USA . 113 parts In-Stock

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$0.990

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$0.603

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Rochester

USA . 20,112 parts In-Stock

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$0.433

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$0.360

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$0.321

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$0.433

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$0.321

Verical

USA . 16,272 parts In-Stock

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$0.612

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$0.546

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Chip1Stop

Japan . 1,138 parts In-Stock

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Edge Electronics

USA . 36 parts In-Stock

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Digiode

USA . 4,486 parts In-Stock

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Vyrian

USA . 3,172 parts In-Stock

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American Microsemiconductor Inc.

USA . 213 parts In-Stock

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Component Electronics Inc.

Canada . 38 parts In-Stock

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$1.150

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$0.870

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$0.750

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38

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DigiKey Marketplace

USA . 20,112 parts In-Stock

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Anansix

USA . 3,229 parts In-Stock

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M&R Communications

USA . 1,802 parts In-Stock

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LWI Electronics Inc

India . 1,723 parts In-Stock

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PC Components Company LLC

USA . 1,480 parts In-Stock

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Bristol Electronics

USA . 1,480 parts In-Stock

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Mil-Aero Solutions, Inc.

USA . 1,298 parts In-Stock

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Semi Source

USA . 1,197 parts In-Stock

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Electronic Expediters

USA . 643 parts In-Stock

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Prism Electronics

USA . 461 parts In-Stock

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Sensible Micro Corp

USA . 303 parts In-Stock

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ComSIT Distribution GmbH

Germany . 191 parts In-Stock

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ComSIT USA

USA . 191 parts In-Stock

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Classic Components Corporation

USA . 48 parts In-Stock

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Carlin Systems, Inc.

USA . 28 parts In-Stock

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Lighthouse Electronics, Inc.

USA . 20 parts In-Stock

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Corphita

USA . 6,438 parts In-Stock

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$0.046

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Corohmni

South Africa . 86 parts In-Stock

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Northwest PG Solutions

USA . 2,120 parts In-Stock

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IDEA Electronic Components Group

UK . 1,451 parts In-Stock

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$27.054

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$24.348

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MKK Technologies

India . 1,604 parts In-Stock

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$50.872

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DigiPath Technology Company

USA . 1,604 parts In-Stock

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Native Components

USA . 904 parts In-Stock

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$442.616

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$433.764

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$429.338

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$424.912

904

$442.616

$433.764

$429.338

$424.912

Continental Prestige Electronics

USA . 20,112 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 12,784 parts In-Stock

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Authorized Procurement Solutions

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Perfect Parts

USA . 4,836 parts In-Stock

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Kulean Microsystems

USA . 4,751 parts In-Stock

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SupplyDigital Components

Austria . 3,374 parts In-Stock

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Supply Digital

USA . 2,422 parts In-Stock

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Problanco Electronics

Mexico . 2,091 parts In-Stock

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Kepictronics

USA . 1,776 parts In-Stock

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Parana Technologies

USA . 1,152 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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Metaverse IC Inc.

Canada . 916 parts In-Stock

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GreenTree Electronics

Israel . 844 parts In-Stock

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TANS Electronics

Latvia . 773 parts In-Stock

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UHIMA Technologies

Türkiye . 746 parts In-Stock

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Technical Specifications

Multiplexer & Demultiplexer 74VHC157M attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Onsemi

Specs

Family:

AHC/VHC

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5.5

Maximum Power Supply Current (ICC):

.04 mA

Propagation Delay At Nominal Supply:

9.5 ns

Propagation Delay (tpd):

15 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

74VHC157M Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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