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74VHC157T

STMicroelectronics

74VHC157T by STMicroelectronics

74VHC157T by STMicroelectronics is a CMOS multiplexer with 4 functions and 2 inputs. It has a propagation delay of 9.5 ns at 3.3V, making it suitable for military-grade applications requiring fast switching capabilities. With a small outline package style and dual terminal position, it is ideal for compact electronic designs in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 848 parts In-Stock

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848

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Vyrian

USA . 790 parts In-Stock

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790

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Digiode

USA . 432 parts In-Stock

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432

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,022 parts In-Stock

1+ parts

$25.302

100+ parts

-

1k+ parts

$22.772

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1,022

$25.302

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$22.772

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Native Components

USA . 574 parts In-Stock

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$26.090

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574

$26.090

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Northwest PG Solutions

USA . 801 parts In-Stock

1+ parts

$28.699

100+ parts

$25.829

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801

$28.699

$25.829

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MKK Technologies

India . 2,175 parts In-Stock

1+ parts

$47.578

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2,175

$47.578

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DigiPath Technology Company

USA . 2,175 parts In-Stock

1+ parts

$47.578

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2,175

$47.578

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Parana Technologies

USA . 1,789 parts In-Stock

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$30.252

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$30.252

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Corphita

USA . 1,133 parts In-Stock

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1,133

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Overview

Enhance your electronic designs with the 74VHC157T by STMicroelectronics, a top-tier manufacturer known for quality and reliability. As a multiplexer/demultiplexer, this versatile component offers seamless integration in a wide range of applications, delivering high performance and efficiency. With a low propagation delay, small outline package style, and a wide supply voltage range, this product provides exceptional value and flexibility for customers looking to optimize their systems. Upgrade your projects with the 74VHC157T and experience the benefits of superior technology and innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body ensures durability and protection for the internal components of the multiplexer/demultiplexer.

Propagation Delay At Nominal Supply: 9.5 ns

The low propagation delay ensures fast and efficient signal processing, making this product suitable for high-speed applications.

Surface Mount: YES

The surface mount capability enables easy and convenient installation on circuit boards, saving space and time during assembly.

No. of Functions: 4

With 4 functions available, this multiplexer/demultiplexer offers versatility and flexibility in signal routing and selection.

Nominal Supply Voltage / Vsup (V): 3.3

The nominal supply voltage of 3.3V is commonly used in many electronic systems, ensuring compatibility with a wide range of applications.

Load Capacitance (CL): 50 pF

The load capacitance of 50 pF indicates the ability of the multiplexer/demultiplexer to drive capacitive loads efficiently.

Operating Temperature Range: -55 °C to 125°C (MILITARY)

The wide operating temperature range makes this product suitable for use in harsh environmental conditions, ideal for military or industrial applications.

Maximum Supply Voltage (Vsup): 5.5V

The maximum supply voltage of 5.5V allows for compatibility with a wide range of power supply configurations, ensuring reliable operation.

Technical Specifications

Multiplexer & Demultiplexer 74VHC157T attributes and parameters. Explore more Multiplexer & Demultiplexer devices from STMicroelectronics

Specs

Family:

AHC/VHC

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e0

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

No. of Functions:

4

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

2/5.5

Propagation Delay At Nominal Supply:

9.5 ns

Propagation Delay (tpd):

15 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

74VHC157T Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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