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74VHC153MX

Onsemi

74VHC153MX by Onsemi

74VHC153MX by Onsemi is a CMOS multiplexer/demultiplexer with 2 functions and 4 inputs. It has a propagation delay of 11 ns at 3.3 V, making it suitable for industrial applications requiring fast switching speeds in a small outline package. With a wide operating temperature range from -40 to 85 °C, this device is ideal for various electronic systems needing reliable signal routing capabilities.

Median Price

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Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

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Bristol Electronics

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ACDS - Activité Composants Distribution Service

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Chip Stock

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Digiode

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Sea View Technologies

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Anansix

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Zilex Electronics Inc.

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Vyrian

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Semi Source

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Ampacity Inc.

Singapore . 598 parts In-Stock

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Kulean Microsystems

USA . 7,691 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Microchip USA

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Authorized Procurement Solutions

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TANS Electronics

Latvia . 2,995 parts In-Stock

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Metaverse IC Inc.

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Corphita

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SupplyDigital Components

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Problanco Electronics

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Supply Digital

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Perfect Parts

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UHIMA Technologies

Türkiye . 748 parts In-Stock

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South Africa . 346 parts In-Stock

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Native Components

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Kepictronics

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Overview

Unlock the power of seamless data processing with the Onsemi 74VHC153MX Multiplexer & Demultiplexer. Manufactured by a trusted industry leader, this high-quality product offers unparalleled performance and reliability. Ideal for a wide range of applications, this versatile component provides customers with the value and benefits they need to stay ahead in today's competitive market. Experience the advantages of this innovative technology and take your projects to the next level with the Onsemi 74VHC153MX.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials are durable and resistant to heat, making this product suitable for industrial applications.

Propagation Delay At Nominal Supply: 11 ns

Low propagation delay ensures fast signal processing, making this product efficient for time-sensitive applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly on printed circuit boards.

No. of Functions: 2

Having multiple functions in a single device saves space and cost in electronic designs.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a standard supply voltage, compatible with many systems.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, suitable for industrial environments.

Minimum Operating Temperature: -40 °C

Operates in extreme cold conditions, providing reliability in various environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the overall performance of the product.

Technical Specifications

Multiplexer & Demultiplexer 74VHC153MX attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Onsemi

Specs

Family:

AHC/VHC

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Inputs:

4

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5.5

Propagation Delay At Nominal Supply:

11 ns

Propagation Delay (tpd):

17.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

74VHC153MX Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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