Loading...

74VHC157MTR

STMicroelectronics

74VHC157MTR by STMicroelectronics

74VHC157MTR by STMicroelectronics is a CMOS multiplexer with a propagation delay of just 9.5 ns and operates at supply voltages b/w 2-5.5 V. It features 4 functions and supports dual inputs, making it ideal for high-speed data routing in compact applications. Its robust design ensures reliable performance across military-grade temperature ranges from -55 °C to 125°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 10,713 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10,713

-

-

-

-

Anansix

USA . 2,380 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,380

-

-

-

-

Digiode

USA . 1,427 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,427

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 123 parts In-Stock

1+ parts

$0.342

100+ parts

-

1k+ parts

-

10k+ parts

-

123

$0.342

-

-

-

Northwest PG Solutions

USA . 2,214 parts In-Stock

1+ parts

$3.430

100+ parts

-

1k+ parts

-

10k+ parts

-

2,214

$3.430

-

-

-

IDEA Electronic Components Group

UK . 1,882 parts In-Stock

1+ parts

$17.376

100+ parts

-

1k+ parts

$15.638

10k+ parts

-

1,882

$17.376

-

$15.638

-

AZTECH Wire

Italy . 137 parts In-Stock

1+ parts

$21.010

100+ parts

-

1k+ parts

-

10k+ parts

-

137

$21.010

-

-

-

MKK Technologies

India . 2,012 parts In-Stock

1+ parts

$32.675

100+ parts

-

1k+ parts

-

10k+ parts

-

2,012

$32.675

-

-

-

DigiPath Technology Company

USA . 2,012 parts In-Stock

1+ parts

$32.675

100+ parts

-

1k+ parts

-

10k+ parts

-

2,012

$32.675

-

-

-

Corphita

USA . 2,367 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,367

-

-

-

-

Parana Technologies

USA . 1,532 parts In-Stock

1+ parts

-

100+ parts

$20.776

1k+ parts

-

10k+ parts

-

1,532

-

$20.776

-

-

Native Components

USA . 70 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.024

10k+ parts

-

70

-

-

$3.024

-

Overview

Unlock unparalleled performance with the 74VHC157MTR multiplexer from STMicroelectronics, a trusted leader in innovation and quality. This compact device excels in speed and versatility, making it perfect for high-speed data routing in telecommunications, automotive systems, and consumer electronics. With ST's commitment to excellence, you gain reliable functionality that enhances your designs while optimizing power efficiency. Elevate your projects with the ultimate in signal management!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides good durability and protection for the internal components, making it suitable for various environments.

Propagation Delay At Nominal Supply: 9.5 ns

A short propagation delay enhances the speed of data transmission, allowing for faster signal processing in high-speed applications.

Surface Mount: YES

Surface mount technology enables compact design and easy integration into modern circuits, saving PCB space.

No. of Functions: 4

Having multiple functions allows for versatile applications, making this product suitable for complex circuit designs.

No. of Inputs: 2

With two inputs, this device supports a variety of signal routing options, enhancing the flexibility of system design.

Package Shape: RECTANGULAR

The rectangular shape of the package maximizes space efficiency on PCBs, facilitating better layout possibilities.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a nominal voltage of 3.3 V aligns with standard digital logic levels, ensuring compatibility with a wide range of devices.

Load Capacitance (CL): 50 pF

A low load capacitance ensures minimal signal distortion and faster switching speeds, which is critical in high-frequency applications.

Power Supplies (V): 2/5.5

The ability to operate within a wide supply voltage range offers flexibility for various power supply situations, accommodating different designs.

No. of Terminals: 16

A higher number of terminals allows for more connection options, making it easier to design around specific circuit requirements.

Package Style (Meter): SMALL OUTLINE

The small outline package style contributes to a compact design, ideal for space-constrained applications.

Maximum I (ol): 8 Amp

Support for high output current allows this multiplexer/demultiplexer to drive substantial loads, increasing its application range.

Propagation Delay (tpd): 15 ns

This propagation delay ensures efficient switching times, perfect for rapid data communication and real-time processing.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature means this product can be used in demanding environments without risk of failure.

Minimum Operating Temperature: -55 °C

The ability to operate in extremely low temperatures extends its usability to harsh environments, such as aerospace and military applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The high-quality terminal finish ensures excellent conductivity and reliability, enhancing long-term performance.

Terminal Position: DUAL

Dual terminal positioning provides better mechanical stability and simplifies the PCB layout process.

Maximum Seated Height: 1.75 mm

A low seated height allows for a more compact assembly and integration into smaller devices.

Width: 3.9 mm

A narrow width enhances design flexibility, allowing for tighter packing of circuit components.

Output Polarity: TRUE

True output polarity ensures compatibility with standard logic levels, simplifying design integration.

Minimum Supply Voltage (Vsup): 2 V

The ability to operate at lower supply voltages allows for energy-efficient designs, reducing power consumption.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum reflow temperature time of 30 seconds accommodates various mounting processes while ensuring component integrity.

Peak Reflow Temperature °C: 260

High peak reflow temperature compatibility ensures its suitability for lead-free soldering processes, aligning with modern manufacturing standards.

Length: 9.9 mm

A compact length is ideal for space-limited applications, providing design engineers with greater flexibility.

Temperature Grade: MILITARY

Military grade certification indicates reliability and performance in extreme conditions, making it suitable for defense applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it ideal for battery-powered applications.

Terminal Form: GULL WING

Gull wing terminals facilitate easier soldering and provide mechanical strength, enhancing the reliability of the connection.

Packing Method: TR

Tape and reel packing method allows for automated handling and assembly, improving manufacturing efficiency.

Terminal Pitch: 1.27 mm

A standard terminal pitch ensures compatibility with common PCB designs and facilitates easier integration into existing layouts.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates reasonable handling precautions, making it suitable for various environmental conditions.

Maximum Supply Voltage (Vsup): 5.5 V

The capability to handle a maximum voltage of 5.5 V makes it versatile for different applications requiring higher voltage levels.

Technical Specifications

Multiplexer & Demultiplexer 74VHC157MTR attributes and parameters. Explore more Multiplexer & Demultiplexer devices from STMicroelectronics

Specs

Family:

AHC/VHC

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

3

No. of Functions:

4

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5.5

Propagation Delay At Nominal Supply:

9.5 ns

Propagation Delay (tpd):

15 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

74VHC157MTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20