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74VHC153M

Onsemi

74VHC153M by Onsemi

74VHC153M by Onsemi is a CMOS multiplexer/demultiplexer with 2 functions and 4 inputs. It has a propagation delay of 11 ns at 3.3 V, making it suitable for industrial applications requiring fast switching speeds in a small outline package. With a max operating temperature of 85 °C and dual terminal position, it offers reliable performance in various electronic systems.

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Lifecycle Status

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Vyrian

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Digiode

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Anansix

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Prism Electronics

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LWI Electronics Inc

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ComSIT Distribution GmbH

Germany . 553 parts In-Stock

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Bristol Electronics

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Pegasus Components GmbH

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PC Components Company LLC

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Electronic Expediters

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Sea View Technologies

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Corohmni

South Africa . 452 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Authorized Procurement Solutions

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Problanco Electronics

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Microchip USA

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Glotronic Ltd.

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Northwest PG Solutions

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Continental Prestige Electronics

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Metaverse IC Inc.

Canada . 676 parts In-Stock

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UHIMA Technologies

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Kepictronics

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Kulean Microsystems

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SupplyDigital Components

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Supply Digital

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Native Components

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Overview

Discover the unmatched quality and reliability of the 74VHC153M by Onsemi, a leading manufacturer in the industry. This multiplexer/demultiplexer offers seamless functionality with 2 functions and 4 inputs, making it a versatile solution for various applications. With a compact rectangular package design and a nominal supply voltage of 3.3V, this product provides exceptional performance with a low propagation delay of 11ns. Experience the value and benefits of using the 74VHC153M in your projects, where precision and efficiency are paramount. Elevate your designs with this cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes this product lightweight and durable.

Propagation Delay At Nominal Supply: 11 ns

Low propagation delay ensures fast and efficient data processing in the multiplexer/demultiplexer.

Surface Mount: YES

The surface-mount capability makes it easy to integrate this product onto a PCB, saving space and simplifying assembly.

Nominal Supply Voltage / Vsup (V): 3.3

Optimal supply voltage ensures stable operation of the multiplexer/demultiplexer.

Maximum Operating Temperature: 85 °C

High maximum operating temperature allows for reliable performance even in harsh environments.

Technical Specifications

Multiplexer & Demultiplexer 74VHC153M attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Onsemi

Specs

Family:

AHC/VHC

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Inputs:

4

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5.5

Propagation Delay At Nominal Supply:

11 ns

Propagation Delay (tpd):

17.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

74VHC153M Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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