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74VHC157SJ

Onsemi

74VHC157SJ by Onsemi

74VHC157SJ by Onsemi is a CMOS multiplexer with 4 functions, 2 inputs, and propagation delay of 9.5 ns at Vsup of 3.3V. It operates in industrial temperature range (-40 to 85 °C) and has a small outline package style suitable for surface mount applications. With a max supply voltage of 3.6V, it is ideal for high-speed signal switching in various electronic circuits.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Anansix

USA . 2,436 parts In-Stock

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Digiode

USA . 1,842 parts In-Stock

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Vyrian

USA . 409 parts In-Stock

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Distributors (Availability)

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Native Components

USA . 520 parts In-Stock

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$9.765

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520

$9.765

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Northwest PG Solutions

USA . 696 parts In-Stock

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$10.742

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$9.667

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696

$10.742

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Ampacity Inc.

Singapore . 172 parts In-Stock

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$50.000

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Component Stockers USA

USA . 377 parts In-Stock

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$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 7,645 parts In-Stock

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SupplyDigital Components

Austria . 7,107 parts In-Stock

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TANS Electronics

Latvia . 7,068 parts In-Stock

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Kulean Microsystems

USA . 4,790 parts In-Stock

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Microchip USA

USA . 4,255 parts In-Stock

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Problanco Electronics

Mexico . 3,900 parts In-Stock

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Supply Digital

USA . 2,037 parts In-Stock

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Corphita

USA . 854 parts In-Stock

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UHIMA Technologies

Türkiye . 553 parts In-Stock

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Corohmni

South Africa . 307 parts In-Stock

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Overview

Experience seamless and efficient data processing with the 74VHC157SJ by Onsemi. Crafted with precision and quality, this multiplexer & demultiplexer offers unmatched reliability and performance. Ideal for a wide range of applications, this product boasts a low propagation delay and high accuracy, ensuring smooth operation in industrial settings. Trust Onsemi's expertise and innovation to deliver value and benefits that exceed expectations. Upgrade your systems with the 74VHC157SJ and elevate your productivity today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and helps in preventing damage to the internal components of the multiplexer & demultiplexer.

Propagation Delay At Nominal Supply: 9.5 ns

Low propagation delay ensures quick data transmission, making this product suitable for high-speed applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient integration onto PCBs, saving space and reducing assembly time.

No. of Functions: 4

Having 4 functions in one device increases versatility and efficiency in data processing and routing.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a common supply voltage of 3.3V makes it compatible with various electronic systems and devices.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliability and stable performance in various environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy efficient and reliable.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and mounting onto PCBs, ensuring secure connections and reliable operation.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures the product can operate in harsh industrial environments without performance degradation.

Technical Specifications

Multiplexer & Demultiplexer 74VHC157SJ attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Onsemi

Specs

Family:

AHC/VHC

JESD-30 Code:

R-PDSO-G16

Length:

10.1 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

No. of Functions:

4

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

RAIL

Maximum Power Supply Current (ICC):

.04 mA

Propagation Delay At Nominal Supply:

9.5 ns

Propagation Delay (tpd):

15 ns

Maximum Seated Height:

2.1 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

5.3 mm

Trade Compliance

74VHC157SJ Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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