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74VHC153MTCX

Onsemi

74VHC153MTCX by Onsemi

74VHC153MTCX by Onsemi is a CMOS multiplexer/demultiplexer with 2 functions and 4 inputs. It operates at a supply voltage range of 2-5.5V, has a propagation delay of 11ns, and can handle load capacitance up to 50pF. Ideal for industrial applications requiring fast signal switching in compact designs.

Median Price

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Connector Distribution Corp

USA . 4,667 parts In-Stock

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Right Parts Inc.

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Martec Srl

Italy . 2,908 parts In-Stock

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ACDS - Activité Composants Distribution Service

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Anansix

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Digiode

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Inventory MP

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Bristol Electronics

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A2Z Electronics, Inc.

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Prism Electronics

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Vyrian

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Rebound Electronics

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Native Components

USA . 716 parts In-Stock

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Northwest PG Solutions

USA . 708 parts In-Stock

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Ampacity Inc.

Singapore . 195 parts In-Stock

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Component Stockers USA

USA . 234 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Metaverse IC Inc.

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SupplyDigital Components

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Problanco Electronics

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Microchip USA

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Glotronic Ltd.

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TANS Electronics

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Corohmni

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UHIMA Technologies

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Overview

Unleash the power of seamless data management with the innovative 74VHC153MTCX by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality multiplexer & demultiplexer solutions that provide unmatched reliability and performance. Perfect for a wide range of applications, this product offers customers the advantage of quick propagation delay at nominal supply, ensuring efficient operation. Elevate your projects with the value and benefits that the 74VHC153MTCX brings to the table, setting you apart from the competition and driving success in today's fast-paced technology landscape.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is lightweight, durable, and cost-effective, making the product easy to handle and resistant to damage.

Propagation Delay At Nominal Supply: 11 ns

Low propagation delay ensures fast signal processing, making this multiplexer/demultiplexer suitable for high-speed applications.

Surface Mount: YES

Surface mount technology allows for easy installation on circuit boards, saving space and enabling efficient design layouts.

No. of Functions: 2

Having 2 functions in one device provides added versatility and functionality for the user.

Nominal Supply Voltage / Vsup (V): 3.3

This voltage compatibility ensures stable and reliable operation within the specified range.

Load Capacitance (CL): 50 pF

A moderate load capacitance makes the product compatible with various output devices and circuits.

Power Supplies (V): 2/5.5

Supporting a range of power supplies allows for flexibility in different system configurations and environments.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable performance in harsh operating conditions.

Technical Specifications

Multiplexer & Demultiplexer 74VHC153MTCX attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Onsemi

Specs

Family:

AHC/VHC

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Inputs:

4

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5.5

Propagation Delay At Nominal Supply:

11 ns

Propagation Delay (tpd):

17.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

74VHC153MTCX Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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