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74VHC153MTC

Onsemi

74VHC153MTC by Onsemi

MULTIPLEXER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: TSSOP; Package Shape: RECTANGULAR;

Median Price

$14.613

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Adafruit Industries

USA . 20 parts In-Stock

1+ parts

$14.613

100+ parts

$13.298

1k+ parts

$11.983

10k+ parts

-

20

$14.613

$13.298

$11.983

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DF Sales Co.

USA . 453 parts In-Stock

1+ parts

$0.250

100+ parts

-

1k+ parts

-

10k+ parts

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453

$0.250

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-

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DF Sales Co.

USA . 453 parts In-Stock

1+ parts

$0.250

100+ parts

-

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10k+ parts

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453

$0.250

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Digiode

USA . 2,297 parts In-Stock

1+ parts

$13.882

100+ parts

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2,297

$13.882

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Chip Stock

USA . 11,189 parts In-Stock

1+ parts

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11,189

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Vyrian

USA . 7,120 parts In-Stock

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7,120

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Martec Srl

Italy . 2,908 parts In-Stock

1+ parts

-

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2,908

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ComSIT Distribution GmbH

Germany . 2,884 parts In-Stock

1+ parts

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2,884

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Bristol Electronics

USA . 1,385 parts In-Stock

1+ parts

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1,385

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Atlantic Semiconductor

USA . 1,385 parts In-Stock

1+ parts

-

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1,385

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Anansix

USA . 1,151 parts In-Stock

1+ parts

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1,151

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Zilex Electronics Inc.

Canada . 117 parts In-Stock

1+ parts

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117

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Flip Electronics

USA . 23 parts In-Stock

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23

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Prism Electronics

USA . 4 parts In-Stock

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4

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 583 parts In-Stock

1+ parts

$0.500

100+ parts

-

1k+ parts

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583

$0.500

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Northwest PG Solutions

USA . 1,112 parts In-Stock

1+ parts

$0.550

100+ parts

-

1k+ parts

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10k+ parts

$0.485

1,112

$0.550

-

-

$0.485

Microchip USA

USA . 4,963 parts In-Stock

1+ parts

$1.113

100+ parts

$1.106

1k+ parts

$1.106

10k+ parts

$1.106

4,963

$1.113

$1.106

$1.106

$1.106

Corphita

USA . 3,408 parts In-Stock

1+ parts

$13.152

100+ parts

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3,408

$13.152

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Advanced Electronics

New Zealand . 20 parts In-Stock

1+ parts

$14.613

100+ parts

$13.298

1k+ parts

$11.983

10k+ parts

-

20

$14.613

$13.298

$11.983

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Corohmni

South Africa . 95 parts In-Stock

1+ parts

$27.742

100+ parts

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95

$27.742

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Authorized Procurement Solutions

USA . 16,000 parts In-Stock

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16,000

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Kulean Microsystems

USA . 7,041 parts In-Stock

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7,041

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SupplyDigital Components

Austria . 5,497 parts In-Stock

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Perfect Parts

USA . 4,045 parts In-Stock

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4,045

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Ashlea Components Ltd (Excess)

UK . 2,908 parts In-Stock

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2,908

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Glotronic Ltd.

UK . 2,300 parts In-Stock

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2,300

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Problanco Electronics

Mexico . 2,192 parts In-Stock

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2,192

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TANS Electronics

Latvia . 1,675 parts In-Stock

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1,675

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UHIMA Technologies

Türkiye . 529 parts In-Stock

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529

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Supply Digital

USA . 473 parts In-Stock

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473

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Speed Components Ltd (Excess)

Israel . 79 parts In-Stock

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79

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Technical Specifications

Multiplexer & Demultiplexer 74VHC153MTC attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Onsemi

Specs

Family:

AHC/VHC

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Inputs:

4

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5.5

Propagation Delay At Nominal Supply:

11 ns

Propagation Delay (tpd):

17.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

74VHC153MTC Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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