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2N6027

Onsemi

2N6027 by Onsemi

Onsemi's 2N6027 is a Programmable UJT with max. on-state current of 0.15A and anode-cathode voltage of 40V. Ideal for applications requiring trigger devices, it operates b/w -50 to 100°C, with min. valley current of 70uA and max. power dissipation of 0.3W in a cylindrical package style.

Median Price

$0.645

Lifecycle Status

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43

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1k+

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TEDSS.com

USA . 300 parts In-Stock

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Advanced Electronics

New Zealand . 70 parts In-Stock

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Corohmni

South Africa . 72 parts In-Stock

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Continental Prestige Electronics

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Argo Parts USA

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Aztec Data Supply Inc.

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AZTECH Wire

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India . 480 parts In-Stock

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One Stop Electronics

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QUARKTWIN TECHNOLOGY LTD

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Glotronic Ltd.

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Overview

Discover the versatile 2N6027 by Onsemi, a top-quality Programmable Unijunction Transistor that offers reliable performance and precise functionality. Manufactured by Onsemi, a trusted industry leader, this UJT is perfect for a wide range of applications, from pulse generation to timing circuits. With a maximum on-state current of 0.15 A and a maximum anode to cathode voltage of 40 V, this product provides exceptional value and benefits to customers. Experience the advantages of the 2N6027 and elevate your electronic projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and resistant to environmental factors, making it suitable for various applications.

Maximum On-state Current: 0.15 A

High on-state current capacity allows for efficient operation and handling of larger loads.

Maximum Anode To Cathode Voltage: 40 V

With a relatively high voltage rating, this UJT can handle moderate power levels.

Maximum Operating Temperature: 100 °C

Wide temperature range allows for operation in various environments without overheating.

Minimum Operating Temperature: -50 °C

Can function in extremely low temperatures, making it versatile for different applications.

Technical Specifications

Programmable Unijunction Transistors (UJT) 2N6027 attributes and parameters. Explore more Programmable Unijunction Transistors (UJT) devices from Onsemi

Specs

Maximum Anode To Cathode Voltage:

40 V

Configuration:

JEDEC-95 Code:

TO-92

JESD-30 Code:

O-PBCY-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Maximum On-state Current:

.15 A

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-50 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

ROUND

Package Style (Meter):

Maximum Peak Current:

2 uA

Peak Reflow Temperature (C):

235

Maximum Power Dissipation:

.3 W

Qualification:

Not Qualified

Sub-Category:

Programmable Unijunction Transistors

Surface Mount:

NO

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

THROUGH-HOLE

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Device Type:

Minimum Valley Current:

70 uA

Trade Compliance

2N6027 Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

NSN

5961-00-106-3698, 5961001063698, 5961-00-432-2808, 5961004322808, 5961-01-112-5312, 5961011125312, 5961-01-030-8062, 5961010308062

NIIN

001063698, 004322808, 011125312, 010308062

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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