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BRY56A

NXP Semiconductors

BRY56A by NXP Semiconductors

PROGRAMMABLE UJT; Package Style (Meter): CYLINDRICAL; Surface Mount: NO; Terminal Position: BOTTOM; Configuration: SINGLE; Maximum Power Dissipation: .3 W;

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Halfin

Belgium . 5,000 parts In-Stock

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5,000

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Digiode

USA . 3,372 parts In-Stock

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3,372

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Anansix

USA . 1,768 parts In-Stock

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1,768

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Vyrian

USA . 74 parts In-Stock

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74

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ECAB

Sweden . 13 parts In-Stock

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13

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 385 parts In-Stock

1+ parts

$0.825

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385

$0.825

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Northwest PG Solutions

USA . 2,955 parts In-Stock

1+ parts

$1.829

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2,955

$1.829

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Modulus Dynamics

Lithuania . 431 parts In-Stock

1+ parts

$3.922

100+ parts

$3.765

1k+ parts

$3.608

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431

$3.922

$3.765

$3.608

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One Stop Electronics

USA . 623 parts In-Stock

1+ parts

$26.100

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623

$26.100

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UNI Independent Distributors

Spain . 5,357 parts In-Stock

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5,357

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Corphita

USA . 4,576 parts In-Stock

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4,576

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Technical Specifications

Programmable Unijunction Transistors (UJT) BRY56A attributes and parameters. Explore more Programmable Unijunction Transistors (UJT) devices from NXP Semiconductors

Specs

Maximum Anode To Cathode Voltage:

1.4 V

Configuration:

JEDEC-95 Code:

TO-92

JESD-30 Code:

O-PBCY-T3

No. of Elements:

1

No. of Terminals:

3

Maximum On-state Current:

.175 A

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-65 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

ROUND

Package Style (Meter):

Maximum Peak Current:

.06 uA

Maximum Power Dissipation:

.3 W

Qualification:

Not Qualified

Sub-Category:

Programmable Unijunction Transistors

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

Trigger Device Type:

Minimum Valley Current:

1 uA

Trade Compliance

BRY56A Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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