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N74F182D-T

NXP Semiconductors

N74F182D-T by NXP Semiconductors

N74F182D-T by NXP Semiconductors is a 4-bit TTL digital arithmetic circuit with a propagation delay of just 8.5 ns. It operates at a nominal voltage of 5V and features a compact SO package with 16 terminals. Ideal for high-speed calculations in commercial applications, it supports temperatures from 0 °C to 70 °C.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Anansix

USA . 1,861 parts In-Stock

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Digiode

USA . 406 parts In-Stock

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406

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Vyrian

USA . 380 parts In-Stock

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380

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Andel Nordic

Denmark . 3,402 parts In-Stock

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$7.878

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$7.563

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One Stop Electronics

USA . 1,433 parts In-Stock

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$58.000

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UNI Independent Distributors

Spain . 8,135 parts In-Stock

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Corphita

USA . 3,792 parts In-Stock

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Overview

Elevate your digital designs with the N74F182D-T from NXP Semiconductors, a trusted leader in innovative solutions. This 4-bit arithmetic circuit offers remarkable speed and efficiency, ensuring swift computation for your applications. With its robust plastic packaging and surface mount capabilities, it seamlessly integrates into various electronic systems, enhancing performance while reducing footprint. Experience quality and reliability that empower your projects to excel!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and protection against environmental factors, making this product reliable for various applications.

Surface Mount: YES

Surface mount technology (SMT) allows for compact design and efficient use of board space, facilitating high-density circuit designs.

Package Shape: RECTANGULAR

The rectangular shape is conducive for layout in PCB designs, enabling easier integration and optimal use of space.

No. of Bits: 4

With 4 bits, this product can process small data efficiently, suitable for applications that handle low to medium complexity data operations.

Nominal Supply Voltage / Vsup (V): 5

A nominal supply voltage of 5V is a standard for many digital circuits, resulting in compatibility with numerous systems and power supplies.

Load Capacitance (CL): 50 pF

The load capacitance of 50 pF offers a balance between performance and speed, making it effective for fast signal processing.

No. of Terminals: 16

Having 16 terminals provides ample connectivity options for various configurations, making it versatile for different circuit designs.

Package Style (Meter): SMALL OUTLINE

The small outline package style enhances space efficiency, allowing it to fit easily onto compact boards.

Propagation Delay (tpd): 8.5 ns

With a propagation delay of only 8.5 ns, this product is suitable for high-speed applications, ensuring quick data processing.

Maximum Operating Temperature: 70 °C

A maximum operating temperature of 70 °C indicates robustness and adaptability to various environments, especially in commercial applications.

Minimum Operating Temperature: 0 °C

The minimum operating temperature of 0 °C ensures functionality in diverse temperature conditions, adding to the reliability.

Terminal Position: DUAL

Dual terminal positioning provides flexibility in layout design and simplifies the routing on PCBs.

Minimum Supply Voltage (Vsup): 4.5 V

A minimum supply voltage of 4.5 V ensures compatibility with a range of power supply options.

Temperature Grade: COMMERCIAL

Being rated for commercial use indicates it meets industry standards for performance and reliability under standard conditions.

Technology: TTL

Using TTL technology ensures fast switching speeds and low power consumption, making it ideal for various digital applications.

Terminal Form: GULL WING

Gull wing terminal form allows for easier soldering and ensures strong connections to the PCB, enhancing reliability.

Maximum Supply Voltage (Vsup): 5.5 V

Supporting a maximum supply voltage of 5.5 V provides added flexibility in power supply design without risking damage to components.

Maximum Power Supply Current (ICC): 36 mA

A maximum power supply current of 36 mA allows for adequate power delivery for devices requiring moderate current, making it suitable for a variety of applications.

Technical Specifications

Digital Arithmetic Circuits N74F182D-T attributes and parameters. Explore more Digital Arithmetic Circuits devices from NXP Semiconductors

Specs

Additional Features:

WITH HIGHER ORDER LOOKAHEAD

Family:

F/FAST

JESD-30 Code:

R-PDSO-G16

Load Capacitance (CL):

50 pF

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Maximum Power Supply Current (ICC):

36 mA

Propagation Delay (tpd):

8.5 ns

Qualification:

Not Qualified

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Position:

DUAL

Trade Compliance

N74F182D-T Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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