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N74F280AN

NXP Semiconductors

N74F280AN by NXP Semiconductors

N74F280AN by NXP Semiconductors is a 9-bit digital arithmetic circuit with a propagation delay of 14.5 ns and operates at a nominal voltage of 5V. It features a dual terminal position in an in-line package, ideal for commercial applications. With a max temp of 70 °C, it suits various electronic designs.

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Lifecycle Status

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8

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Digiode

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Vyrian

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Anansix

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Inland Empire Components Inc.

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Halfin

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Prism Electronics

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Corel Iberica Componentes, S.L.

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Bristol Electronics

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One Stop Electronics

USA . 1,464 parts In-Stock

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UNI Independent Distributors

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Corphita

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Assy Fe

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Overview

Unlock the potential of your digital designs with the N74F280AN from NXP Semiconductors—a trusted leader in innovation. This high-quality 9-bit arithmetic circuit delivers outstanding performance for a variety of applications, from computing to control systems. With its robust construction and reliable operation at elevated temperatures, this component not only enhances system durability but also ensures efficiency and speed. Experience the unparalleled value and reliability that NXP brings to your projects!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to environmental factors, making the product reliable in various applications.

Package Shape: RECTANGULAR

A rectangular package shape optimizes board space and layout, facilitating better integration into designs.

No. of Bits: 9

With 9 bits, this product offers a good balance between complexity and capability, suitable for most digital computation needs.

Nominal Supply Voltage / Vsup: 5 V

Operating at a standard 5V supply voltage makes it compatible with a wide range of electronic systems.

Load Capacitance (CL): 50 pF

A load capacitance of 50 pF allows for stable operation in fast-switching applications.

No. of Terminals: 14

With 14 terminals, there is ample connectivity for interfacing with other components.

Package Style (Meter): IN-LINE

The in-line package style simplifies mounting and contributes to efficient cabling in circuit designs.

Propagation Delay (tpd): 14.5 ns

A propagation delay of 14.5 ns ensures quick response times, making this product suitable for high-speed applications.

Maximum Operating Temperature: 70 °C

The ability to operate at temperatures up to 70 °C enhances reliability in warmer environments.

Minimum Operating Temperature: 0 °C

This temperature range ensures functionality in numerous applications, from room temperature to moderate heat.

Terminal Position: DUAL

Dual terminal positioning aids in compact circuit design while providing flexibility in layout options.

Maximum Seated Height: 4.2 mm

A low seated height of 4.2 mm reduces spatial needs on a PCB, allowing for more compact designs.

Width: 7.62 mm

The 7.62 mm width enables integration into slim designs, fitting into space-constrained applications.

Output Polarity: COMPLEMENTARY

Complementary output polarity provides design flexibility allowing for various logic configurations.

Minimum Supply Voltage (Vsup): 4.5 V

The minimum supply voltage is low enough to accommodate a range of power sources.

Length: 19.025 mm

At a length of 19.025 mm, this component maintains a compact profile that aids in efficient layout.

Temperature Grade: COMMERCIAL

Being classified as commercial grade means this product meets the general reliability standards for consumer electronics.

Technology: TTL

Using TTL technology ensures fast switching speeds and compatibility with a broad range of digital circuits.

Terminal Form: THROUGH-HOLE

Through-hole terminal form provides robust mechanical connections, enhancing durability within the circuit.

Terminal Pitch: 2.54 mm

A terminal pitch of 2.54 mm is a standard size that simplifies soldering and board design, making it easy to work with.

Maximum Supply Voltage (Vsup): 5.5 V

The maximum supply voltage allows some flexibility in power supply choices while ensuring safe operation.

Maximum Power Supply Current (ICC): 35 mA

30 mA power supply current means efficient operation with minimal power draw, making it suitable for battery-powered applications.

Technical Specifications

Digital Arithmetic Circuits N74F280AN attributes and parameters. Explore more Digital Arithmetic Circuits devices from NXP Semiconductors

Specs

Additional Features:

ODD/EVEN PARITY GENERATOR

Family:

F/FAST

JESD-30 Code:

R-PDIP-T14

Length:

19.025 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Bits:

9

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Maximum Power Supply Current (ICC):

35 mA

Propagation Delay (tpd):

14.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.2 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

N74F280AN Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-366-6493, 5962013666493

NIIN

013666493

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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