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N74F280AD-T

NXP Semiconductors

N74F280AD-T by NXP Semiconductors

N74F280AD-T by NXP Semiconductors is a 9-bit digital arithmetic circuit with a propagation delay of 14.5 ns and operates at a nominal voltage of 5V. It features a compact SO package, ideal for space-constrained applications. This TTL technology component supports dual terminal positioning and is suitable for commercial use.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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EMSNET

USA . 4,550 parts In-Stock

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Vyrian

USA . 2,722 parts In-Stock

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Anansix

USA . 2,440 parts In-Stock

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Digiode

USA . 235 parts In-Stock

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Andel Nordic

Denmark . 3,166 parts In-Stock

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$11.091

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$10.648

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$10.648

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$10.648

One Stop Electronics

USA . 193 parts In-Stock

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$34.000

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Corphita

USA . 4,860 parts In-Stock

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UNI Independent Distributors

Spain . 3,138 parts In-Stock

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Overview

Unlock unparalleled performance with the N74F280AD-T from NXP Semiconductors, a leader in innovative digital solutions. This versatile 9-bit arithmetic circuit offers exceptional reliability in diverse applications, from computing to industrial controls. Designed for seamless integration and efficiency, it enhances your projects with low propagation delay and robust temperature tolerance. Experience quality you can trust and elevate your designs with NXP’s expertly crafted technology today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight materials enhance product reliability and performance in various environments.

Surface Mount: YES

Allows for compact design and improved space utilization on PCB layouts.

Package Shape: RECTANGULAR

Standard shape facilitates easy integration into existing circuit designs, ensuring compatibility.

No. of Bits: 9

Offers sufficient data handling capability for various digital applications, improving processing efficiency.

Nominal Supply Voltage / Vsup: 5V

Standard voltage used in many applications, ensuring broad compatibility with existing systems.

Load Capacitance (CL): 50 pF

Ensures stable performance while allowing for faster switching speeds, ideal for high-speed applications.

No. of Terminals: 14

Provides multiple connection options for flexibility in circuit design and integration.

Package Style (Meter): SMALL OUTLINE

Compact package style allows for efficient use of space, making it suitable for space-constrained applications.

Propagation Delay (tpd): 14.5 ns

Low propagation delay ensures quick response times, essential for high-performance digital circuits.

Maximum Operating Temperature: 70 °C

Suitable for operation in a wide range of environments, ensuring reliability in various temperature conditions.

Minimum Operating Temperature: 0 °C

Ensures functionality in cooler environments, expanding the range of applicable use cases.

Terminal Position: DUAL

Facilitates easier mounting and versatility in PCB design.

Maximum Seated Height: 1.75 mm

Low profile design is advantageous for applications with height restrictions.

Width: 3.9 mm

Compact width allows for dense packing of components on circuit boards.

Output Polarity: COMPLEMENTARY

Complementary output enables a variety of circuit configurations, improving design flexibility.

Minimum Supply Voltage (Vsup): 4.5V

Allows for operation in a range of environments with different supply conditions.

Length: 8.65 mm

Ideal length for various applications, balancing performance and space efficiency.

Temperature Grade: COMMERCIAL

Designed for standard commercial applications, ensuring cost-effectiveness without sacrificing quality.

Technology: TTL

Transistor-Transistor Logic technology provides reliable performance and ease of integration.

Terminal Form: GULL WING

Gull wing terminals provide secure connections and ease of soldering on PCBs.

Terminal Pitch: 1.27 mm

Standard terminal pitch supports ease of manufacturing and compatibility with existing PCB designs.

Maximum Supply Voltage (Vsup): 5.5V

Allows flexibility in power supply design while ensuring safe operation under varied load conditions.

Maximum Power Supply Current (ICC): 35 mA

Low current requirement makes it power-efficient, reducing overall energy consumption in devices.

Technical Specifications

Digital Arithmetic Circuits N74F280AD-T attributes and parameters. Explore more Digital Arithmetic Circuits devices from NXP Semiconductors

Specs

Additional Features:

ODD/EVEN PARITY GENERATOR

Family:

F/FAST

JESD-30 Code:

R-PDSO-G14

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Bits:

9

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Maximum Power Supply Current (ICC):

35 mA

Propagation Delay (tpd):

14.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

N74F280AD-T Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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