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N74F181D-T

NXP Semiconductors

N74F181D-T by NXP Semiconductors

N74F181D-T by NXP Semiconductors is a 4-bit digital arithmetic circuit with a propagation delay of 12.5 ns and operates at a nominal voltage of 5V. It features a compact SO package, ideal for space-constrained applications. This TTL technology component supports commercial temperature ranges from 0 °C to 70 °C.

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1k+

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Anansix

USA . 671 parts In-Stock

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Andel Nordic

Denmark . 1,205 parts In-Stock

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$5.645

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One Stop Electronics

USA . 552 parts In-Stock

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UNI Independent Distributors

Spain . 4,588 parts In-Stock

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Corphita

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Overview

Unlock the power of precision with the N74F181D-T from NXP Semiconductors, a leader in innovative technology. This versatile digital arithmetic circuit delivers exceptional speed and reliability, making it ideal for a wide range of applications, from embedded systems to complex computing tasks. Experience superior performance and efficiency, ensuring your designs are not just functional but also future-ready. Elevate your projects with the trusted quality that only NXP can provide!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material offers durability and reliability, making the package suitable for a wide range of applications.

Surface Mount: YES

Surface mount capability allows for high-density circuit designs, enabling compact device layouts.

Package Shape: RECTANGULAR

The rectangular shape is ideal for maximizing board space while allowing for efficient thermal management.

No. of Bits: 4

With 4 bits, this circuit is well-suited for applications that require moderate data processing capabilities.

Nominal Supply Voltage / Vsup: 5 V

A standard nominal supply voltage of 5V ensures compatibility with numerous digital systems.

Load Capacitance (CL): 50 pF

A load capacitance of 50 pF helps maintain signal integrity and ensures stable operation in fast-switching applications.

No. of Terminals: 24

The 24 terminals provide ample connectivity options for interfacing with various components and systems.

Package Style (Meter): SMALL OUTLINE

The small outline package style allows for space-efficient designs, suitable for compact electronic devices.

Propagation Delay (tpd): 12.5 ns

A low propagation delay of 12.5 ns enables high-speed data processing, making it suitable for performance-critical applications.

Maximum Operating Temperature: 70 °C

This product is rated for operation up to 70 °C, meaning it can withstand demanding environmental conditions.

Minimum Operating Temperature: 0 °C

Operating from 0 °C ensures reliable performance in typical room temperature applications.

Terminal Position: DUAL

Dual terminal position allows for flexible mounting options on PCBs, enhancing design versatility.

Maximum Seated Height: 2.65 mm

A low seated height of 2.65 mm contributes to unobtrusive designs and helps maintain low-profile components.

Width: 7.5 mm

The width of 7.5 mm supports efficient layout and minimizes the footprint on the PCB.

Minimum Supply Voltage (Vsup): 4.5 V

The minimum supply voltage of 4.5 V allows for operation in power-sensitive applications while maintaining performance.

Length: 15.4 mm

A length of 15.4 mm supports compact designs without sacrificing terminal accessibility.

Temperature Grade: COMMERCIAL

Commercial temperature grading ensures reliable functionality in standard operating environments.

Technology: TTL

TT technology ensures fast switching and low-power consumption, making it ideal for digital applications.

Terminal Form: GULL WING

Gull wing terminal form allows for easier soldering and handling during assembly processes.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm facilitates compatibility with many PCB designs, easing integration.

Maximum Supply Voltage (Vsup): 5.5 V

The maximum supply voltage of 5.5 V provides a buffer for voltage variations, improving reliability.

Maximum Power Supply Current (ICC): 65 mA

A maximum power supply current of 65 mA indicates strong performance capabilities for demanding applications.

Technical Specifications

Digital Arithmetic Circuits N74F181D-T attributes and parameters. Explore more Digital Arithmetic Circuits devices from NXP Semiconductors

Specs

Additional Features:

CAPABLE OF 16 LOGIC & ARITHMETIC OPERATIONS; INTERNAL CARRY AND HIGHER ORDER LOOKAHEAD

Family:

F/FAST

JESD-30 Code:

R-PDSO-G24

Length:

15.4 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Maximum Power Supply Current (ICC):

65 mA

Propagation Delay (tpd):

12.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

N74F181D-T Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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