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N74F181N

NXP Semiconductors

N74F181N by NXP Semiconductors

N74F181N by NXP Semiconductors is a 4-bit digital arithmetic circuit with a propagation delay of 12.5 ns and operates at a nominal voltage of 5V. It features a dual terminal form in an in-line package, suitable for commercial applications. With a max temp of 70 °C and load capacitance of 50 pF, it ensures reliable performance.

Median Price

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Lifecycle Status

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4

In-Stock Inventory

1k+

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Digiode

USA . 4,558 parts In-Stock

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Vyrian

USA . 3,143 parts In-Stock

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Anansix

USA . 1,862 parts In-Stock

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Resion

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Andel Nordic

Denmark . 878 parts In-Stock

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$5.916

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$5.679

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One Stop Electronics

USA . 1,568 parts In-Stock

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Semicontronic

India . 1,266 parts In-Stock

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UNI Independent Distributors

Spain . 3,989 parts In-Stock

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Corphita

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Assy Fe

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Overview

Unlock the power of precision with the N74F181N from NXP Semiconductors, a trusted leader in digital solutions. This versatile 4-bit arithmetic circuit enhances your projects by delivering rapid calculations and unmatched reliability, perfect for both commercial and industrial applications. Experience superior performance, thanks to its robust design and efficient operation. Elevate your electronics with a component that truly adds value and efficiency to your designs!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to environmental factors, making this product suitable for various applications.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient space utilization on printed circuit boards, facilitating easier integration into designs.

No. of Bits: 4

Having 4 bits supports a variety of simple digital arithmetic operations, making it an ideal choice for compact applications.

Nominal Supply Voltage / Vsup: 5V

Operating at a nominal supply voltage of 5V, this product is compatible with standard digital logic systems, ensuring easy integration.

Load Capacitance (CL): 50 pF

With a load capacitance of 50 pF, this circuit can reliably handle iterative digital logic signals, enhancing performance in most applications.

No. of Terminals: 24

The 24 terminals provide ample connectivity options, allowing for versatile circuit designs and expansions as needed.

Package Style (Meter): IN-LINE

The in-line package style facilitates straightforward assembly and soldering processes in manufacturing, improving production efficiency.

Propagation Delay (tpd): 12.5 ns

A propagation delay of 12.5 ns indicates fast signal processing, which is crucial for high-speed digital applications.

Maximum Operating Temperature: 70 °C

Operating effectively at temperatures up to 70 °C ensures reliability in various environmental conditions, making it suitable for commercial use.

Minimum Operating Temperature: 0 °C

With a minimum operating temperature of 0 °C, this product can function reliably in cooler environments, broadening its application range.

Terminal Position: DUAL

The dual terminal position enhances flexibility in circuit design and component placement, simplifying integration in diverse layouts.

Minimum Supply Voltage (Vsup): 4.5 V

The ability to operate down to 4.5 V ensures stability and functionality across a range of standard supply voltages.

Temperature Grade: COMMERCIAL

Classified as commercial-grade, this product delivers consistent performance in typical operating conditions expected in general applications.

Technology: TTL

Utilizing TTL technology ensures fast switching and robust performance, making this product a reliable choice for digital circuits.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide high reliability and easy handling during assembly, making this product user-friendly for prototyping and production.

Maximum Supply Voltage (Vsup): 5.5 V

The maximum supply voltage of 5.5 V allows for some headroom in power supply design, catering to different circuit configurations.

Maximum Power Supply Current (ICC): 65 mA

The power supply current limitation of 65 mA ensures efficient power consumption, contributing to the overall energy efficiency of the system.

Technical Specifications

Digital Arithmetic Circuits N74F181N attributes and parameters. Explore more Digital Arithmetic Circuits devices from NXP Semiconductors

Specs

Additional Features:

CAPABLE OF 16 LOGIC & ARITHMETIC OPERATIONS; INTERNAL CARRY AND HIGHER ORDER LOOKAHEAD

Family:

F/FAST

JESD-30 Code:

R-PDIP-T24

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Maximum Power Supply Current (ICC):

65 mA

Propagation Delay (tpd):

12.5 ns

Qualification:

Not Qualified

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Position:

DUAL

Trade Compliance

N74F181N Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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