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N74F182D

NXP Semiconductors

N74F182D by NXP Semiconductors

N74F182D by NXP Semiconductors is a 4-bit digital arithmetic circuit with a fast propagation delay of 8.5 ns and operates at a nominal voltage of 5V. It features a compact SO package, ideal for space-constrained applications. This TTL technology device supports surface mount design, making it suitable for modern electronics.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,017 parts In-Stock

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3,017

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Anansix

USA . 2,219 parts In-Stock

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2,219

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Digiode

USA . 956 parts In-Stock

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956

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Distributors (Availability)

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Andel Nordic

Denmark . 3,420 parts In-Stock

1+ parts

$6.940

100+ parts

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$6.663

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$6.663

3,420

$6.940

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$6.663

One Stop Electronics

USA . 872 parts In-Stock

1+ parts

$43.000

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872

$43.000

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Corphita

USA . 3,156 parts In-Stock

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3,156

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UNI Independent Distributors

Spain . 1,990 parts In-Stock

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1,990

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Overview

Elevate your digital design with the N74F182D from NXP Semiconductors, a trusted leader in innovation and quality. This powerful 4-bit arithmetic circuit delivers swift performance and reliability, perfect for a variety of applications—from complex computing tasks to everyday electronics. With its compact design and robust build, it effortlessly enhances efficiency while minimizing power consumption, making it an invaluable asset for engineers striving for excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures robust performance and reliability across various applications.

Surface Mount: YES

Surface mount capability allows for reduced board space and improved assembly time in modern electronics.

Package Shape: RECTANGULAR

Rectangular package shape provides efficient layout and enhances routing flexibility in PCB design.

No. of Bits: 4

A 4-bit configuration is ideal for various digital logic applications, providing a compact solution without sacrificing functionality.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V ensures compatibility with a wide range of existing digital systems.

Load Capacitance (CL): 50 pF

A load capacitance of 50 pF supports adequate performance in typical signal processing scenarios.

No. of Terminals: 16

Sixteen terminals offer flexibility for various input/output configurations, enhancing circuit design options.

Package Style (Meter): SMALL OUTLINE

The small outline package style reduces the footprint on the PCB, allowing for denser circuit designs.

Propagation Delay (tpd): 8.5 ns

A low propagation delay of 8.5 ns ensures rapid response times, making it suitable for high-speed applications.

Maximum Operating Temperature: 70 °C

Operating up to 70 °C ensures reliable performance in moderate temperature conditions, suitable for many applications.

Minimum Operating Temperature: 0 °C

The minimum operating temperature of 0 °C allows usage in a variety of environments, enhancing its versatility.

Terminal Position: DUAL

Dual terminal position facilitates efficient soldering and improves contact reliability in the assembly process.

Minimum Supply Voltage (Vsup): 4.5 V

The ability to operate at a minimum of 4.5 V enhances power management options for various applications.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures stability and performance in general use cases, making it suitable for everyday products.

Technology: TTL

Utilizing TTL technology guarantees compatibility with a broad range of digital components and systems.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy handling and improved solder joint visibility during manufacturing.

Maximum Supply Voltage (Vsup): 5.5 V

A maximum supply voltage of 5.5 V offers flexibility for over-voltage conditions without compromising reliability.

Maximum Power Supply Current (ICC): 36 mA

A maximum current of 36 mA supports significant operational capacity while maintaining energy efficiency.

Technical Specifications

Digital Arithmetic Circuits N74F182D attributes and parameters. Explore more Digital Arithmetic Circuits devices from NXP Semiconductors

Specs

Additional Features:

WITH HIGHER ORDER LOOKAHEAD

Family:

F/FAST

JESD-30 Code:

R-PDSO-G16

Load Capacitance (CL):

50 pF

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Maximum Power Supply Current (ICC):

36 mA

Propagation Delay (tpd):

8.5 ns

Qualification:

Not Qualified

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Position:

DUAL

Trade Compliance

N74F182D Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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