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N74F181D

NXP Semiconductors

N74F181D by NXP Semiconductors

N74F181D by NXP Semiconductors is a 4-bit digital arithmetic circuit with a propagation delay of 12.5 ns, operating at a nominal voltage of 5V. It features a compact SO package and supports surface mount technology. Ideal for high-speed computing applications, it operates within -0 °C to 70 °C.

Median Price

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Lifecycle Status

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4

In-Stock Inventory

1k+

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Anansix

USA . 2,637 parts In-Stock

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Vyrian

USA . 2,579 parts In-Stock

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Digiode

USA . 2,314 parts In-Stock

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Resion

USA . 31 parts In-Stock

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Andel Nordic

Denmark . 2,464 parts In-Stock

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$8.508

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One Stop Electronics

USA . 500 parts In-Stock

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$62.000

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UNI Independent Distributors

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Corphita

USA . 2,275 parts In-Stock

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Overview

Unlock the power of precision with the N74F181D from NXP Semiconductors, a trusted leader in digital technology. This advanced 4-bit arithmetic circuit enhances your applications with unmatched reliability and performance. Ideal for digital computing tasks, it seamlessly integrates into your designs, ensuring efficiency and speed. Experience superior quality backed by NXP's renowned expertise, delivering exceptional value to elevate your projects to new heights!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material ensures reliability and protects against environmental factors, making the product suitable for various applications.

Surface Mount: YES

Surface mount technology allows for a smaller footprint on PCBs, facilitating more efficient designs and higher component density.

Package Shape: RECTANGULAR

The rectangular shape provides an optimal layout for circuit board integration, promoting ease of placement and efficient space utilization.

No. of Bits: 4

Having 4 bits allows for a balance between complexity and processing capability, making it suitable for various digital arithmetic operations.

Nominal Supply Voltage / Vsup: 5 V

A nominal supply voltage of 5 V is standard for many digital circuits, ensuring compatibility with a wide range of existing systems.

Load Capacitance (CL): 50 pF

A load capacitance of 50 pF allows for efficient signal processing, minimizing delays in circuit response.

No. of Terminals: 24

With 24 terminals, the product offers multiple connectivity options, enhancing its versatility in various circuit configurations.

Package Style (Meter): SMALL OUTLINE

The small outline package style minimizes space requirements, making it suitable for compact electronic designs.

Propagation Delay (tpd): 12.5 ns

A propagation delay of 12.5 ns indicates fast signal transmission, making the product ideal for high-speed digital applications.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, this product is capable of functioning in a wide range of environmental conditions.

Minimum Operating Temperature: 0 °C

Starting at a minimum operating temperature of 0 °C, this product can operate in cooler environments, broadening its application range.

Terminal Position: DUAL

The dual terminal position provides for efficient layout and improved routing on printed circuit boards.

Maximum Seated Height: 2.65 mm

A low seated height allows for a slim profile, which is advantageous for space-constrained applications.

Width: 7.5 mm

Compact width of 7.5 mm ensures easy integration into tight spaces on PCBs.

Minimum Supply Voltage (Vsup): 4.5 V

The minimum supply voltage of 4.5 V allows for flexible system design, accommodating a range of power supply options.

Length: 15.4 mm

At a length of 15.4 mm, this component fits well in smaller electronic assemblies while providing ample functionality.

Temperature Grade: COMMERCIAL

Rated for commercial temperature grades, this product ensures reliability and performance in typical operating environments.

Technology: TTL

Utilizing TTL technology, this product offers fast switching times and high noise immunity, making it a dependable choice for digital circuits.

Terminal Form: GULL WING

The gull wing terminal form allows for reliable soldering and easy inspection, contributing to overall assembly quality.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm facilitates compatibility with various surface mount PCB designs.

Maximum Supply Voltage (Vsup): 5.5 V

A maximum supply voltage of 5.5 V ensures robust operation while preventing damage from excessive voltage inputs.

Maximum Power Supply Current (ICC): 65 mA

With a maximum power supply current of 65 mA, this product is efficient, offering low power consumption for energy-sensitive applications.

Technical Specifications

Digital Arithmetic Circuits N74F181D attributes and parameters. Explore more Digital Arithmetic Circuits devices from NXP Semiconductors

Specs

Additional Features:

CAPABLE OF 16 LOGIC & ARITHMETIC OPERATIONS; INTERNAL CARRY AND HIGHER ORDER LOOKAHEAD

Family:

F/FAST

JESD-30 Code:

R-PDSO-G24

Length:

15.4 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Maximum Power Supply Current (ICC):

65 mA

Propagation Delay (tpd):

12.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

N74F181D Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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