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MPC8347CVVAGDB

NXP Semiconductors

MPC8347CVVAGDB by NXP Semiconductors

The NXP Semiconductors MPC8347CVVAGDB is a 32-bit microprocessor with integrated cache, operating at a max clock frequency of 66 MHz. It features low power mode and boundary scan capabilities, making it ideal for industrial applications requiring high-speed processing in compact form factors.

Median Price

$95.108

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

MPC8347CVVAGDB by NXP Semiconductors
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Flip Electronics (Authorized)

USA . 3,752 parts In-Stock

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Verical

USA . 717 parts In-Stock

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$99.075

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$88.650

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$83.425

717

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$83.425

Rochester

USA . 11 parts In-Stock

1+ parts

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$91.140

1k+ parts

$81.550

10k+ parts

$76.750

11

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$91.140

$81.550

$76.750

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Digiode

USA . 3,351 parts In-Stock

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$83.657

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Flip Electronics

USA . 1,872 parts In-Stock

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Vyrian

USA . 1,491 parts In-Stock

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Chip Stock

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Anansix

USA . 990 parts In-Stock

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990

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Nova Conductors

Japan . 100 parts In-Stock

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TME

Poland . 2 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,327 parts In-Stock

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$74.850

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$74.850

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Corphita

USA . 386 parts In-Stock

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$79.254

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Vigor

Singapore . 335 parts In-Stock

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$144.100

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Microchip USA

USA . 1,403 parts In-Stock

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$169.530

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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UNI Independent Distributors

Spain . 326 parts In-Stock

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Bastille Electronics

Australia . 120 parts In-Stock

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Perfect Parts

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Overview

Discover the cutting-edge MPC8347CVVAGDB by NXP Semiconductors, a top-tier manufacturer known for its superior quality in microprocessors. This innovative product offers unparalleled value with its integrated cache, low power mode, and industrial-grade temperature range. Ideal for a wide range of applications, this microprocessor delivers exceptional performance and reliability. Experience the benefits of advanced technology and seamless connectivity with the MPC8347CVVAGDB - the perfect choice for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and heat resistance, making the product suitable for various operating conditions.

Integrated Cache: YES

The integrated cache enhances performance by storing frequently accessed data, resulting in faster processing speeds.

Surface Mount: YES

The surface mount feature facilitates easy installation and reduces the overall footprint of the product in a circuit design.

Maximum Supply Voltage: 1.26 V

The high maximum supply voltage allows for efficient power management and flexibility in operating conditions.

Address Bus Width: 32

The 32-bit address bus width enables the processor to access a larger memory space, increasing performance and efficiency.

Package Shape: SQUARE

The square package shape offers a compact design, optimizing space utilization in electronic devices.

Bit Size: 32

The 32-bit bit size ensures compatibility with a wide range of applications and enhances processing capabilities.

Power Supplies (V): 1.2

The nominal power supply voltage of 1.2V ensures energy efficiency and stable performance of the processor.

No. of Terminals: 672

The high number of terminals allows for seamless connectivity and integration within a circuit system.

Package Style (Meter): GRID ARRAY, LOW PROFILE

The grid array, low profile package style enhances thermal management and overall reliability of the product.

Technical Specifications

Microprocessors MPC8347CVVAGDB attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Additional Features:

ALSO REQUIRES 2.5V AND 3.3V SUPPLY

Address Bus Width:

32

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

66 MHz

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B672

JESD-609 Code:

e2

Length:

35 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

672

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA672,34X34,40

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2

Qualification:

Not Qualified

Maximum Seated Height:

1.69 mm

Speed:

400 rpm

Sub-Category:

Microprocessors

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

35 mm

Peripheral IC Type:

Trade Compliance

MPC8347CVVAGDB Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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