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LS1024ASE7JLA

NXP Semiconductors

LS1024ASE7JLA by NXP Semiconductors

MULTIFUNCTION PERIPHERAL; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 625; Package Code: FBGA; Package Shape: SQUARE;

Median Price

$48.670

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 691 parts In-Stock

1+ parts

-

100+ parts

$48.670

1k+ parts

$43.550

10k+ parts

$40.980

691

-

$48.670

$43.550

$40.980

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,374 parts In-Stock

1+ parts

$51.366

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2,374

$51.366

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Vyrian

USA . 5,385 parts In-Stock

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5,385

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Anansix

USA . 1,654 parts In-Stock

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Flip Electronics

USA . 431 parts In-Stock

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431

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 664 parts In-Stock

1+ parts

$11.180

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664

$11.180

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Corphita

USA . 2,476 parts In-Stock

1+ parts

$48.663

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$48.663

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Corohmni

South Africa . 63 parts In-Stock

1+ parts

$76.716

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63

$76.716

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Vigor

Singapore . 60 parts In-Stock

1+ parts

$77.580

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60

$77.580

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Microchip USA

USA . 434 parts In-Stock

1+ parts

$241.784

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434

$241.784

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QUARKTWIN TECHNOLOGY LTD

USA . 4,375 parts In-Stock

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UNI Independent Distributors

Spain . 1,200 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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Technical Specifications

Multi-functional Peripherals LS1024ASE7JLA attributes and parameters. Explore more Multi-functional Peripherals devices from NXP Semiconductors

Specs

Address Bus Width:

26

Boundary Scan:

YES

Maximum Clock Frequency:

900 MHz

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B625

Length:

21 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

625

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-10 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA625,25X25,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

250

Maximum Seated Height:

2.67 mm

Maximum Supply Current:

1400 mA

Maximum Supply Voltage:

1.155 V

Minimum Supply Voltage:

1.045 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

21 mm

Peripheral IC Type:

Trade Compliance

LS1024ASE7JLA Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.1

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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